METHOD FOR STACKED PATTERN DESIGN OF PRINTED CIRCUIT BOARD AND SYSTEM THEREOF

• US 20090031273A1
• Filed: 01/08/2008
• Published: 01/29/2009
• Est. Priority Date: 07/27/2007
• Status: Active Grant

• Current Assignee: King Yuan Electronics Company Limited
• Original Assignee: King Yuan Electronics Company Limited
• Inventors: TSAI, Ming-Chin
• Granted Patent: US 7,870,527 B2
• Time in Patent Office: Days
• US Class Current: 716/119
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: G06N 3/126 Evolutionary algorithms, e.g. genetic algorithms or genetic programming
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 3/0005 for designing circuits by computer
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A method for designing stacked pattern of PCB utilizing genetic algorithm and the system thereof are disclosed. The method comprises the following steps: First of all, information data of stacked pattern is inputted into operational interface of the software; Next, initial solution sets of stacked pattern are generated; Then, duplications of the initial solution sets of stacked pattern are generated according to a fitness function; Afterward, crossover of the duplications of stacked pattern are performed at random; Then, mutations are executed by a probability at random; Finally, identification is performed to check if the solution approaches the standard of demand and the result of stacked pattern is shown; otherwise, operational step jumps to duplicate step and repeats above steps until satisfying solution is obtained. The most suitable way for package can be arranged out through making especially mathematical calculations by the system efficiently.

Claims

1. A system for stacked pattern design of printed circuit board, including:

an input unit used to receive information data of stacked pattern;

a processing unit connected the input unit wherein a stacked pattern of printed circuit board is calculated by the processing unit using genetic algorithm;

a storage unit connected the processing unit wherein a plurality of current parameters of printed circuit board are stored in the storage unit; and

an output unit connected the processing unit wherein the result of the stacked pattern of printed circuit board is displayed by the output unit.

2. The system of claim 1, wherein said input unit comprises an user interface which receives and displays the information data.

3. The system of claim 2, wherein said user interface comprises automatic stack mode and assigned stack mode.

4. The system of claim 1, wherein said information data of stacked pattern include type of PCB, type of top layer, PCB manufacturer, material of top layer, thickness of foil, numbers of signal layer, numbers of power layer, line-width, or total thickness of stacked pattern.

5. The system of claim 4, wherein said types of PCB comprise probe card, load board, or DUT board.

6. The system of claim 4, wherein said types of top layer comprise signal layer or ground layer.

7. The system of claim 4, wherein said materials of top layer comprise PP or FR4.

8. The system of claim 1, wherein said processing unit which could load program to execute at least includes a processor and a memory.

9. The system of claim 1, wherein function of each layer of PCB could be determined by said processing unit depending on the information data.

10. The system of claim 1, wherein thickness of each layer of PCB could be determined by said processing unit depending on the information data.

11. A method utilizing genetic algorithm for stacked pattern design of printed circuit board, including:

(a) inputting information data of stacked pattern into user interface of software;

(b) generating initial solution sets of stacked pattern according to the information data;

(c) generating the duplications of the initial solution sets of stacked pattern according to a fitness function;

(d) performing a crossover of the duplications of stacked pattern at random;

(e) executing mutations at random and obtaining the result of stacked pattern;

(f) performing an identification to check if the solution approaches the standard of demand;

(e) displaying the result of stacked pattern; and

(h) repeating step (c)˜

(f) until the result of stacked pattern is reached the standard of demand;

whereby manual operation is replaced and time is saved.

12. The method of claim 11, wherein said method of stacked pattern design uses genetic algorithm to operate.

13. The method of claim 11, wherein said interface of input user software comprises automatic stack mode or assigned stack mode.

14. The method of claim 11, wherein said information data comprise type of PCB, type of top layer, PCB manufacturer, material of top layer, thickness of copper foil, numbers of signal layer, numbers of power layer, line-width, or total thickness of stacked pattern.

15. The method of claim 14, wherein said types of PCB comprise probe card, load board, or DUT board.

16. The method of claim 14, wherein said types of top layer comprise signal layer or ground layer.

17. The method of claim 14, wherein said materials of top layer comprise PP or FR4.

18. The method of claim 11, wherein said initial solution sets of stacked pattern is generated by using current PP layers and FR4 layers which are provided by PCB manufacturer and stored in database to construct.

19. The method of claim 11, wherein said fitness function expresses as F(x)=1/[(thickness of demand minus total thickness of stacked pattern)+1], and the total thickness of stacked pattern is calculated by summing all thickness of PP layers and thickness of FR4 layers, therefore, the highest value of the fitness function could be 1 as the thickness of demand equals to the thickness of stacked pattern.

20. The method of claim 11, wherein said standard of demand is that error of total thickness of the stacked pattern must be smaller than 5%.

21. A computer-readable medium having computer-executable instructions for performing a method utilizing genetic algorithm for stacked pattern design of PCB, which comprising:

(a) inputting information data of stacked pattern into user interface of software;

(b) generating initial solution sets of stacked pattern according to the information data;

(c) generating the duplications of the initial solution sets of stacked pattern according to a fitness function;

(d) performing a crossover of the duplications of stacked pattern at random;

(e) executing mutations at random and obtaining the result of stacked pattern;

(f) performing an identification to check if the solution approaches the standard of demand;

(e) displaying the result of stacked pattern; and

(h) repeating step (c)˜

(f) until the result of stacked pattern is reached the standard of demand;

whereby manual operation is replaced and time is saved.

22. The computer-readable medium of claim 21, wherein said method of stacked pattern design uses genetic algorithm to operate.

23. The computer-readable medium of claim 21, wherein said user interface of input software comprises automatic stack mode or assigned stack mode.

24. The computer-readable medium of claim 21, wherein said information data comprise type of PCB, type of top layer, PCB manufacturer, material of top layer, thickness of copper foil, numbers of signal layer, numbers of power layer, line-width, or total thickness of stacked pattern.

25. The computer-readable medium of claim 24, wherein said types of PCB comprise probe card, load board, or DUT board.

26. The computer-readable medium of claim 24, wherein said types of top layer comprise signal layer or ground layer.

27. The computer-readable medium of claim 24, wherein said materials of top layer comprise PP or FR4.

28. The computer-readable medium of claim 21, wherein said initial solution sets of stacked pattern is generated by using current PP layers which are stored in database to construct.

29. The computer-readable medium of claim 21, wherein said initial solution sets of stacked pattern is generated by using current FR4 layers which are stored in database to construct.

30. The computer-readable medium of claim 21, wherein said fitness function expresses as F(x)=1/[(thickness of demand minus total thickness of stacked pattern)+1], and the total thickness of stacked pattern is calculated by summing all thickness of PP layers and thickness of FR4 layers up, therefore, the highest value of the fitness function could be 1 as the thickness of demand equals to the thickness of stacked pattern.

31. The computer-readable medium of claim 21, wherein said standard of demand is that error of total thickness of the stacked pattern must be smaller than 5%.

32. A graphical user interface in a computer system, including:

a display device;

a selection device; and

a method for providing and selecting, the method comprising;

(a) inputting information data of stacked pattern into user interface of software;

(b) generating initial solution sets of stacked pattern according to the information data;

(c) generating the duplications of the initial solution sets of stacked pattern according to a fitness function;

(d) performing a crossover of the duplications of stacked pattern at random;

(e) executing mutations at random and obtaining the result of stacked pattern;

(f) performing an identification to check if the solution approaches the standard of demand;

(e) displaying the result of stacked pattern; and

(h) repeating step (c)˜

(f) until the result of stacked pattern is reached the standard of demand;

whereby manual operation is replaced and time is saved.

33. The graphical user interface of claim 32, wherein parameters of stacked pattern and results of stacked pattern are displayed by said display device.

34. The graphical user interface of claim 32, wherein said selection device provides a drop-down menu for user to select.

35. The graphical user interface of claim 32, wherein said method of stacked pattern design uses genetic algorithm to operate.

36. The graphical user interface of claim 33, wherein said user interface of input software comprises automatic stack mode or assigned stack mode.

37. The graphical user interface of claim 32, wherein said information data comprise type of PCB, type of top layer, PCB manufacturer, material of top layer, thickness of copper foil, numbers of signal layer, numbers of power layer, line-width, or total thickness of stacked pattern.

38. The graphical user interface of claim 37, wherein said types of PCB comprise probe card, load board, or DUT board.

39. The graphical user interface of claim 37, wherein

said types of top layer comprise signal layer or ground layer.

40. The graphical user interface of claim 37, wherein said materials of top layer comprise PP or FR4.

41. The graphical user interface of claim 33, wherein said initial solution sets of stacked pattern is generated by using current PP layers which are stored in database to construct.

42. The graphical user interface of claim 33 wherein said initial solution sets of stacked pattern is generated by using current FR4 layers which are stored in database to construct.

43. The graphical user interface of claim 33, wherein said fitness function expresses as F(x)=1/[(thickness of demand minus total thickness of stacked pattern)+1], and the total thickness of stacked pattern is calculated by summing all thickness of PP layers and thickness of FR4 layers up, therefore, the highest value of the fitness function could be 1 as the thickness of demand equals to the thickness of stacked pattern.

44. The graphical user interface of claim 33, wherein said standard of demand is that error of total thickness of the stacked pattern must be smaller than 5%.