Radio Frequency Identification Interrogation Systems and Methods of Operating The Same

• US 20090040025A1
• Filed: 10/09/2008
• Published: 02/12/2009
• Est. Priority Date: 03/26/2004
• Status: Abandoned Application

• Current Assignee: John P. Volpi, Joseph Edward Tepera, Logan Scott, Steven D. Roemerman
• Original Assignee: John P. Volpi, Joseph Edward Tepera, Logan Scott, Steven D. Roemerman
• Inventors: Volpi, John P., Roemerman, Steven D., Scott, Logan, Tepera, Joseph Edward
• Application Number:
  US12/248,752
• Publication Number:
  US 20090040025A1
• Time in Patent Office: Days
• US Class Current: 340/10.100
• CPC Class Codes: G01S 13/751 wherein the responder or reflector radiates a coded signal
• CPC Class Codes: G01S 13/767 Responders; Transponders teaching or practice apparatus for gun-aiming or gun-laying using reflecting targets or active targets F41G3/26
• CPC Class Codes: G01S 13/825 with exchange of information between interrogator and responder
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/0739 the incapacitated circuit being part of an antenna

Abstract

A reply code for a radio frequency identification (RFID) tag, a method of improving a reply code for a radio frequency identification (RFID) tag for interrogation by an interrogator and an RFID tag employing the same. In one embodiment, the reply code includes a preamble having information about a quality of a clock associated with the RFID tag. The reply code also includes a tag identification (ID) code providing a digital signature for the RFID tag. The reply code still further includes an aftamble located aft of the preamble and having information about the quality of the clock. The aftamble cooperates with the preamble to improve a quality of the reply code for interrogation by an interrogator.

Claims

1. A radio frequency identification (RFID) tag, comprising:

a substrate having an electronic circuit and an antenna coupled thereto; and

a non-electrical destruction mechanism coupled to the substrate and configured to render said RFID tag inoperative upon an occurrence of an event.

2. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism is configured to destroy an integrity of one of said electronic circuit and said antenna.

3. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises perforations in said substrate configured to tear said substrate to destroy an integrity of one of said electronic circuit and said antenna.

4. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises a lanyard attached to said substrate configured to tear said substrate to destroy an integrity of one of said electronic circuit and said antenna.

5. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises a pull tab attached to said substrate configured to destroy an integrity of one of said electronic circuit and said antenna by pulling said pull tab away from said substrate.

6. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises an environmentally sensitive component attached to said substrate.

7. The RFID tag as recited in claim 6 wherein said environmentally sensitive component is selected from the group consisting of:

a thermocouple,

a thermister,

an acoustic sensor,

a pressure sensor,

a light sensor, and

an acceleration sensor.

8. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises a chemical destruction mechanism.

9. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises a supporting spacer between said electronic circuit and said substrate configured to fail under acceleration to destroy an integrity of said electronic circuit.

10. The RFID tag as recited in claim 1 wherein said non-electrical destruction mechanism comprises a back side etch in said electronic circuit configured to cause a failure thereof.

11. A method of operating a radio frequency identification (RFID) tag, comprising:

providing a substrate having an electronic circuit and an antenna coupled thereto; and

rendering said RFID tag inoperative with a non-electrical destruction mechanism coupled to the substrate upon an occurrence of an event.

12. The method as recited in claim 11 wherein said rendering comprises destroying an integrity of one of said electronic circuit and said antenna.

13. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises perforations in said substrate and said rendering comprises tearing said substrate along said perforations to destroy an integrity of one of said electronic circuit and said antenna.

14. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises a lanyard attached to said substrate and said rendering comprises tearing said substrate with said lanyard to destroy an integrity of one of said electronic circuit and said antenna.

15. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises a pull tab attached to said substrate and said rendering comprises pulling said pull tab away from said substrate to destroy an integrity of one of said electronic circuit and said antenna.

16. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises an environmentally sensitive component attached to said substrate.

17. The method as recited in claim 16 wherein said environmentally sensitive component is selected from the group consisting of:

a thermocouple,

a thermister,

an acoustic sensor,

a pressure sensor,

a light sensor, and

an acceleration sensor.

18. The method tag as recited in claim 11 wherein said non-electrical destruction mechanism comprises a chemical destruction mechanism.

19. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises a supporting spacer between said electronic circuit and said substrate and said rendering comprises causing said supporting spacer to fail under acceleration to destroy an integrity of said electronic circuit.

20. The method as recited in claim 11 wherein said non-electrical destruction mechanism comprises a back side etch in said electronic circuit and said rendering comprises causing a failure of said electronic circuit in accordance with said back side etch.