METHODS FOR GENERATING A STANDARD REFERENCE DIE FOR USE IN A DIE TO STANDARD REFERENCE DIE INSPECTION AND METHODS FOR INSPECTING A WAFER
First Claim
1. A computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection, comprising:
- acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer;
combining the output for the centrally located die and the one or more dies based on within die positions of the output; and
generating the standard reference die based on results of said combining.
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Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
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Citations
45 Claims
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1. A computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection, comprising:
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acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer; combining the output for the centrally located die and the one or more dies based on within die positions of the output; and generating the standard reference die based on results of said combining. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for inspecting a wafer, comprising:
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acquiring output of an inspection system for the wafer; combining the output for a centrally located die on the wafer and one or more dies located on the wafer based on within die positions of the output; generating a standard reference die based on results of said combining; and comparing the standard reference die to the output for one or more test dies on the wafer to detect defects in the one or more test dies. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for inspecting a wafer, comprising:
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acquiring output of an inspection system for a standard reference wafer; combining the output for a centrally located die on the standard reference wafer and one or more dies located on the standard reference wafer based on within die positions of the output; generating a standard reference die based on results of said combining; acquiring output of the inspection system for the wafer; and comparing the standard reference die to output for one or more test dies on the wafer to detect defects in the one or more test dies. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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32. A computer-implemented method for detecting defects on a wafer, comprising:
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combining multiple images of a structure formed on the wafer to generate a composite image of the structure, wherein the multiple images are acquired at multiple positions on the wafer at which the structure is formed; and comparing the composite image to a reference to detect defects on the wafer. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification