System for the Manufacture of Electronic Assemblies Without Solder

• US 20090041977A1
• Filed: 08/06/2008
• Published: 02/12/2009
• Est. Priority Date: 08/06/2007
• Status: Abandoned Application

• Current Assignee: Occam Portfolio LLC
• Original Assignee: Occam Portfolio LLC
• Inventors: Fjelstad, Joseph C.
• Application Number:
  US12/187,323
• Publication Number:
  US 20090041977A1
• Time in Patent Office: Days
• US Class Current: 428/131
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10628 Leaded surface mounted device soldering surface mounted leaded components H05K3/3421
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 2203/1469 Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4614 : the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4664 : Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 428/24273 : including aperture
• CPC Class Codes: Y10T 428/24479 : including variation in thickness

Abstract

The present invention provides an electronic assembly 400 and a machine 800 for its manufacture. The assembly 400 has no solder. Components 406, or component packages 402, with I/O leads 412 sit on a planar substrate. The machine 800 encapsulates the components 406 or component packages, with electrically insulating material with vias 420 extending through the substrate to the components'"'"' leads 412. Then the machine 800 plates the components'"'"' leads and forms traces. Next, the machine 800 covers the plated material with electrically insulating material. Additional vias may extend through the material covering the plated material and in turn be plated and covered. The machine 800 repeats the formation of vias, plating, and coverings of the assembly as desired.

Claims

1. An apparatus comprising a machine capable of performing the following steps in order:

wherein a first step comprises placing at least one component package on a substrate, the component package having at least one side, the substrate having a first planar side and a second planar side,

wherein a second step comprises incorporating a first electrically insulating material, the insulating material attaching at least one side of the at least one component package to the first planar side of the substrate.

2. The apparatus of claim 1 further capable of performing the following steps:

wherein a third step comprises turning the substrate over and removing the substrate, and,

wherein a fourth step comprises plating one or more component leads with electrically conductive material to form one or more traces on the first electrically insulating material.

3. The apparatus of claim 1 further capable of performing the following steps:

wherein a third step comprises turning the substrate over,

wherein a fourth step comprises forming one or more vias extending through the substrate and exposing a first set of one or more leads of the at least one component package, and

wherein a fifth step comprises plating the second planar surface with electrically conductive material to form a second set of one or more leads so that the one or more vias are filled with the electrically conductive material and the first set of one or more leads is in electrical communication with the second set of one or more leads.

4. The apparatus of claim 2 further capable of performing the following step:

wherein a fifth step comprises depositing a layer of second electrically insulating material on the electrically conductive material.

5. The apparatus of claim 3 further capable of performing the following step:

wherein a sixth step comprises depositing a layer of second electrically insulating material on the electrically conductive material.

6. The apparatus of claim 4 further capable of performing the following step:

wherein a sixth step comprises forming a first set of at least one via through the second electrically insulating material exposing a first set of at least one lead of the at least one component package.

7. The apparatus of claim 5 further capable of performing the following step:

wherein a seventh step comprises forming a first set of at least one via through the second electrically insulating material exposing a first set of at least one lead of the at least one component package.

8. The apparatus of claim 1 wherein the least one component package is tested and burned in.

10. A product manufactured by the machine of claim 1.

11. A product manufactured by the machine of claim 2.

12. A product manufactured by the machine of claim 3.

13. A product manufactured by the machine of claim 4.

14. A product manufactured by the machine of claim 5.

15. A product manufactured by the machine of claim 6.

16. A product manufactured by the machine of claim 7.

9. An apparatus comprising a machine capable of performing the following steps in order:

wherein a first step comprises placing at least one component package on a substrate, the component package having at least one side, the substrate having a first planar side and a second planar side,

wherein a second step comprises incorporating a first electrically insulating material, the insulating material attaching at least one side of the at least one component package to the first planar side of the substrate,

wherein a third step comprises removing the substrate and plating one or more component leads to form one or more traces on the first electrically insulating material, and,

wherein a fourth step comprises depositing a layer of second electrically insulating material on the electrically conductive material.

17. A product manufactured by the machine of claim 9.