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Fabrication method of an organic substrate having embedded active-chips

  • US 20090042336A1
  • Filed: 01/30/2008
  • Published: 02/12/2009
  • Est. Priority Date: 08/06/2007
  • Status: Abandoned Application
First Claim
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1. The fabrication method of an organic substrate having embedded active-chips comprising the steps of:

  • (a) stacking the second copper clad laminate formed with copper wirings, vias, and cavities on the top surface of the first copper clad laminate formed with the copper wirings or the copper wirings and the vias;

    (b) applying anisotropic conductive adhesives or non-conductive adhesives to the front side of a semiconductor wafer and then positioning semiconductor chips diced into individual chips inside the cavities of the second copper clad laminate and connecting the copper wirings of the first copper clad laminate to a flip chip by applying heat and pressure; and

    (c) stacking the third copper clad laminate formed with the copper wirings or the copper wirings and the vias on the top surface of the second copper clad laminate to which the semiconductor chips are connected.

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