Semiconductor integrated circuit device and fabrication method thereof
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Abstract
A semiconductor integrated circuit device and a fabrication method thereof are disclosed, for effective suppression of a temperature increase therein that is caused by heat generation of a semiconductor element. The semiconductor integrated circuit device includes a semiconductor element, a multi-layer wiring structure and a heat conduction part. The semiconductor element is formed on a support substrate. The multi-layer wiring structure is formed in an insulation film on the support substrate and includes at least one connection hole and at least one metal wiring layer. The heat conduction part is formed of the same conductive materials as the connection hole and the metal wiring layer and extends toward an upper layer side along a path different from a wiring path including a connection hole and a metal wiring for signal transmission.
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Citations
15 Claims
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1-13. -13. (canceled)
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14. A method of fabricating a standard cell type semiconductor integrated circuit device having a plurality of semiconductor elements, the method comprising the steps of:
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modularizing the plurality of semiconductor elements for each function thereof so as to form a plurality of function modules; maintaining the plurality of function modules as standard cells in a library; and arranging the standard cells in the standard cell type semiconductor integrated circuit device, wherein at least one of the standard cells comprises a heat conduction part, said heat conduction part comprising the same conductive materials as a connection hole and a metal wiring layer constituting a multi-layer wiring structure, said heat conduction part extending toward an upper layer side along a path different from a wiring path comprising a connection hole and a metal wiring layer for signal transmission. - View Dependent Claims (15)
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Specification