Method and system for cutting solid materials using short pulsed laser

• US 20090045179A1
• Filed: 08/15/2007
• Published: 02/19/2009
• Est. Priority Date: 08/15/2007
• Status: Abandoned Application

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Williams, Ellen Marie Kosik
• Application Number:
  US11/893,185
• Publication Number:
  US 20090045179A1
• Time in Patent Office: Days
• US Class Current: 219/121.720
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove

Abstract

A method of cutting a solid material using a pulsed laser includes providing a pulsed laser beam, selecting a target point in the solid material, focusing the pulsed laser beam on the solid material such that at the target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material, and effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a scribe line in the solid material and then a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.

Claims

1. A method of cutting a solid material using a pulsed laser, comprising:

providing a pulsed laser beam;

selecting a target point in the solid material;

focusing the pulsed laser beam on the solid material such that at the target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material; and

effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a first scribe line in the solid material and then traces a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.

2. The method of claim 1, further including moving the target point deeper into the solid material and repeating focusing the pulsed laser beam and effecting relative motion of the pulsed laser beam to deepen the single cut line.

3. The method of claim 2, further comprising repeating moving the target point, focusing the pulsed laser beam, and effecting relative motion of the pulsed laser beam until the single cut line reaches a desired depth in the solid material.

4. The method of claim 3, wherein the desired depth is equal to a thickness of the solid material.

5. The method of claim 3, wherein the desired depth is greater than 200 μ

m.

6. The method of claim 3, wherein the ratio of the desired depth to the kerf width of the single cut line is 5 or greater.

7. The method of claim 1, wherein the essentially parallel paths are linear.

8. The method of claim 1, wherein the essentially parallel paths are curvilinear.

9. The method of claim 1, wherein pulse duration of the pulsed laser beam is in a range from 10 femtoseconds to 200 picoseconds.

10. The method of claim 1, wherein the solid material is a large bandgap material.

11. The method of claim 1, wherein the solid material is a transparent material.

12. A system for cutting a solid material, comprising:

a laser device for providing a pulsed laser beam;

a support for mounting the solid material thereon; and

a mechanism for effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a first scribe line in the solid material and then traces a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.

13. The system of claim 12, further comprising an optical system which focuses the pulsed laser beam such that at a target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material.

14. The system of claim 12, further comprising a control apparatus which controls the mechanism to effect relative motion of the pulsed laser beam with respect to the solid material.

15. The system of claim 12, wherein the pulsed laser generates laser pulses with a duration in a range from 10 femtoseconds to 200 picoseconds.