Partitioning of electronic packages
First Claim
1. An electronic sensor package, comprising:
- (a) an electronic component;
(b) a sensor device, wherein said sensor device comprises a working component for sensing a condition external to said sensor device;
(c) one or more electrical connectors, wherein said one or more electrical connectors connect said electronic component and said sensor device; and
(d) a dam, wherein said dam is written to partition said electronic sensor package into at least a first section and a second section, wherein said sensor device is situated at least partially in said first section, wherein said electronic component is situated at least partially in said second section, wherein said first section is at least partially filled with a first fill material, wherein said second section is at least partially filled with a second fill material, and wherein said first fill material is different from said second fill material.
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Accused Products
Abstract
Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, whilst the section with the electronic component can be filled with a highly moisture protective epoxy.
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Citations
20 Claims
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1. An electronic sensor package, comprising:
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(a) an electronic component; (b) a sensor device, wherein said sensor device comprises a working component for sensing a condition external to said sensor device; (c) one or more electrical connectors, wherein said one or more electrical connectors connect said electronic component and said sensor device; and (d) a dam, wherein said dam is written to partition said electronic sensor package into at least a first section and a second section, wherein said sensor device is situated at least partially in said first section, wherein said electronic component is situated at least partially in said second section, wherein said first section is at least partially filled with a first fill material, wherein said second section is at least partially filled with a second fill material, and wherein said first fill material is different from said second fill material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of packaging a sensor device, the method comprising:
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(a) providing a container, wherein said container comprises; (i) an electronic component; (ii) a sensor device for sensing a condition external to said sensor device; and (iii) one or more electrical connectors, wherein said one or more electrical connectors connect said electronic component and said sensor device; (b) writing a dam to partition said container into at least a first section and a second section, wherein said sensor device is situated at least partially in said first section, wherein said electronic component is situated at least partially in said second section; (c) at least partially filling said first section with a first fill material; and (d) at least partially filling said second section with a second fill material, wherein said second fill material is different from said first fill material. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification