×

TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC's

  • US 20090045516A1
  • Filed: 09/03/2008
  • Published: 02/19/2009
  • Est. Priority Date: 12/21/1998
  • Status: Active Grant
First Claim
Patent Images

1. An integrated circuit chip comprising:

  • a silicon substrate;

    a transistor in and on said silicon substrate;

    a first dielectric layer over said silicon substrate;

    a first metallization structure over said first dielectric layer, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;

    a second dielectric layer between said first and second metal layers;

    a passivation layer over said first metallization structure and over said first and second dielectric layers; and

    a second metallization structure over said passivation layer, wherein said second metallization structure comprises a metal plane and a first metal piece at a same horizontal level, wherein said first metal piece is separate from and enclosed by said metal plane, and wherein a length of said first metal piece is greater than a width of said first metal piece.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×