TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC's
First Claim
Patent Images
1. An integrated circuit chip comprising:
- a silicon substrate;
a transistor in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first metallization structure and over said first and second dielectric layers; and
a second metallization structure over said passivation layer, wherein said second metallization structure comprises a metal plane and a first metal piece at a same horizontal level, wherein said first metal piece is separate from and enclosed by said metal plane, and wherein a length of said first metal piece is greater than a width of said first metal piece.
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Abstract
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
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Citations
20 Claims
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1. An integrated circuit chip comprising:
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a silicon substrate; a transistor in and on said silicon substrate; a first dielectric layer over said silicon substrate; a first metallization structure over said first dielectric layer, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer; a second dielectric layer between said first and second metal layers; a passivation layer over said first metallization structure and over said first and second dielectric layers; and a second metallization structure over said passivation layer, wherein said second metallization structure comprises a metal plane and a first metal piece at a same horizontal level, wherein said first metal piece is separate from and enclosed by said metal plane, and wherein a length of said first metal piece is greater than a width of said first metal piece. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated circuit chip comprising:
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a silicon substrate; multiple devices in and on said silicon substrate, wherein said multiple devices comprise a transistor in and on said silicon substrate; a first dielectric layer over said silicon substrate; a first metallization structure over said first dielectric layer, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer; a second dielectric layer between said first and second metal layers; a passivation layer over said first metallization structure and over said first and second dielectric layers; and a second metallization structure over said passivation layer, wherein said second metallization structure comprises a metal plane and a metal trace at a same horizontal level, wherein said metal trace is separate from said metal plane and enclosed by an opening in said metal plane, wherein said opening has opposite both sides extending along opposite both sides of said metal trace. - View Dependent Claims (9, 10, 11, 12, 13)
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14. An integrated circuit chip comprising:
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a silicon substrate; a transistor in and on said silicon substrate; a first dielectric layer over said silicon substrate; a first metallization structure over said first dielectric layer, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer; a second dielectric layer between said first and second metal layers; a passivation layer over said first metallization structure and over said first and second dielectric layers; a polymer layer over said passivation layer; and a second metallization structure over said passivation layer, wherein said second metallization structure comprises a first metal piece and a second metal piece at a same horizontal level, wherein said first metal piece is separate from and enclosed by said second metal piece. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification