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High-speed router with backplane using muli-diameter drilled thru-holes and vias

  • US 20090045889A1
  • Filed: 08/13/2007
  • Published: 02/19/2009
  • Est. Priority Date: 08/13/2007
  • Status: Active Grant
First Claim
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1. A circuit board comprising:

  • a plurality of conductive layers separated by insulating layers, at least some of the conductive layers patterned to contain traces; and

    a first hole through the circuit board and having a conductive liner in a first longitudinal segment of the hole, the conductive liner electrically connected to a first one of the traces on at least a first one of the conductive layers, the hole having a second longitudinal segment with no conductive liner, adjacent to a first end of the hole, the second longitudinal segment of the hole comprising at least one transition from a first profile adjacent the first end of the hole to a second profile longitudinally separated from the first end of the hole.

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