SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device, comprising:
- a semiconductor chip on which a switching element is formed;
a mounting substrate on which the semiconductor chip is mounted with an intervening solder layer;
a heat dissipation mechanism that dissipates heat generated by the semiconductor chip;
a current detection circuit that detects current flowing in the switching element;
a voltage detection circuit that detects a voltage applied to the switching element;
a loss calculation circuit that calculates a loss occurring in the switching element based on the current detected by the current detection circuit and the voltage detected by the voltage detection circuit;
a temperature detection mechanism that detects a temperature of the semiconductor chip; and
a thermal resistance calculation circuit that calculates a thermal resistance in a dissipation path from the semiconductor chip based on the switching element loss calculated by the loss calculation circuit and the semiconductor chip temperature detected by the temperature detection mechanism.
3 Assignments
0 Petitions
Accused Products
Abstract
In order to enable detection of degradation of the heat dissipation from a semiconductor chip, even when the operating state of a semiconductor device cannot be predicted, a thermal resistance calculation circuit calculates the thermal resistance of the heat dissipation path from the semiconductor chip, based on the loss of a switching element calculated by a loss calculation circuit and the temperature of the semiconductor chip calculated by a temperature calculation portion, and when the voltage corresponding to the thermal resistance calculated by the thermal resistance calculation circuit exceeds a reference voltage, switching operation of the switching element is halted.
20 Citations
12 Claims
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1. A semiconductor device, comprising:
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a semiconductor chip on which a switching element is formed; a mounting substrate on which the semiconductor chip is mounted with an intervening solder layer; a heat dissipation mechanism that dissipates heat generated by the semiconductor chip; a current detection circuit that detects current flowing in the switching element; a voltage detection circuit that detects a voltage applied to the switching element; a loss calculation circuit that calculates a loss occurring in the switching element based on the current detected by the current detection circuit and the voltage detected by the voltage detection circuit; a temperature detection mechanism that detects a temperature of the semiconductor chip; and a thermal resistance calculation circuit that calculates a thermal resistance in a dissipation path from the semiconductor chip based on the switching element loss calculated by the loss calculation circuit and the semiconductor chip temperature detected by the temperature detection mechanism. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification