PICK AND PLACE MACHINE WITH IMPROVED COMPONENT PICK UP INSPECTION

• US 20090046921A1
• Filed: 10/29/2008
• Published: 02/19/2009
• Est. Priority Date: 10/05/2004
• Status: Abandoned Application

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Manickam, Swaminathan, Case, Steven K., Haugen, Paul R., Fisher, Lance K., Badar, Timothy G., Duquette, David W., Fishbaine, David, Madsen, David D.
• Application Number:
  US12/260,361
• Publication Number:
  US 20090046921A1
• Time in Patent Office: Days
• US Class Current: 382/145
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: Y10T 29/53039 with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53091 for work-holder for assembly or disassembly
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.

Claims

1. A pick and place machine for assembly of a workpiece, the machine comprising:

a placement head having at least one nozzle for releasably holding the component;

a robotic system for generating relative movement between the placement head and the workpiece;

a image acquisition system disposed to obtain an image of a pick up location of a component;

a trigger mechanism disposed to detect the position of the placement head during a pick up cycle; and

wherein the image acquisition system is triggered at selected intervals to generate a sequence of images of the pick up cycle.

2. The system of claim 1, wherein the images are acquired during the pick up of a single component.

3. The system of claim 1, wherein the images are acquired during the pick of several components.

4. A method of picking up a component during a pick and place operation the method comprising:

capturing an image of a component before it is picked up by a pick and place machine;

capturing an image of the component at least once after the component is picked up;

comparing the image acquired before pickup and the image acquired after pick up to determine a characteristic of the pick up operation;

generating a pick indication based upon the comparison.

5. The method of claim 4 and further comprising:

sensing motion blur of at least one of the images; and

detecting an amount of motion from the sensed blur.

6. A method for programming a pick and place machine to assemble a workpiece the method comprising of:

acquiring at least one image of a component pick up operation;

displaying at least one image of a component pick up operation; and

adjusting at least one parameter of the pick and place program using the displayed image.