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Integrated micro electro-mechanical system and manufacturing method thereof

  • US 20090049911A1
  • Filed: 10/10/2008
  • Published: 02/26/2009
  • Est. Priority Date: 02/25/2005
  • Status: Abandoned Application
First Claim
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1. An integrated micro electromechanical system, comprising:

  • a semiconductor substrate;

    a plurality of transistors formed on said semiconductor substrate;

    an interlayer dielectric formed over said plurality of transistors;

    a cavity formed in said interlayer dielectric;

    an acceleration sensor formed in said cavity, and having a movable mass, a movable capacitor plate fixed to said movable mass, and a fixed capacitor plate fixed to said interlayer dielectric and opposed to said movable capacitor plate; and

    an etching stopper film to which a part of an upper surface has been exposed in bottom of said cavity,wherein said movable mass, said movable capacitor plate and said fixed capacitor plate are composed of a first interconnect layer,wherein said etching stopper form is composed of a second interconnect layer between said plurality of transistors and said first interconnect layer, andwherein said etching stopper film functions as an electric shield between said acceleration sensor and an integrated circuit including said plurality of transistors.

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