Solid state lighting component

• US 20090050908A1
• Filed: 06/05/2008
• Published: 02/26/2009
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated, Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Philips Solid State Lighting Solutions Inc (Signify N.V.), CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Ibbetson, James, Morgan, Frederick, Keller, Bernd, Lys, Ihor, Tarsa, Eric, Dowling, Kevin, Yuan, Thomas
• Granted Patent: US 9,793,247 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

Claims

1. A monolithic light emitting diode (LED) package, comprising an LED array generating light having a luminous flux greater than 800 lumens at a color temperature less than 3000 K.

2. A monolithic light emitting diode (LED) package, comprising an LED array capable of emitting light while being driven by a current of less than approximately 150 milli-Amps.

3. The LED package of claim 2, wherein said LED array is capable of being driven by a current in the range of approximately 50 milli-Amps to less than approximately 150 milli-Amps.

4. A monolithic light emitting diode (LED) package, comprising of an array of LED chips arranged under a single lens in a substantially or non-rectangular layout.

5. The LED package of claim 4, wherein said LED chips have a size of less than 500 microns.

6. The LED package of claim 4, wherein said lens is flat.

7. The LED package of claim 4, wherein said LED chips are mounted on a substrate comprising FR4 board.

8. A monolithic light emitting diode (LED) package, comprising an array of LED chips arranged in under a single lens in an asymmetric layout.

9. A monolithic light emitting diode (LED) package, comprising an array of LED chips, wherein each of said LED chips emits light at a first or second color, said LED chips emitting at said first color randomly arranged in relation to said LEDs chips emitting at said second color.