LIGHT-EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF
First Claim
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1. A light-emitting diode (LED) apparatus comprising:
- an epitaxial layer having a first semiconductor layer, an active layer and a second semiconductor layer; and
an etching mask layer disposed on the epitaxial layer and having a plurality of hollows.
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Abstract
A light-emitting diode (LED) apparatus includes an epitaxial layer and an etching mask layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The etching mask layer is disposed on the epitaxial layer and has a plurality of hollows. The second semiconductor layer includes a roughing structure.
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Citations
24 Claims
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1. A light-emitting diode (LED) apparatus comprising:
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an epitaxial layer having a first semiconductor layer, an active layer and a second semiconductor layer; and an etching mask layer disposed on the epitaxial layer and having a plurality of hollows. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A manufacturing method of a light-emitting diode (LED) apparatus, comprising steps of:
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forming a first semiconductor layer, an active layer and a second semiconductor layer on an epitaxial substrate in sequence; and forming an etching mask layer on the second semiconductor layer, wherein the etching mask layer and the second semiconductor layer have a plurality of first hollows and a plurality of second hollows, respectively; - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A manufacturing method of a light-emitting diode (LED) apparatus, comprising steps of:
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forming a first semiconductor layer, an active layer and a second semiconductor layer on an epitaxial substrate in sequence; forming a first current diffusing layer on the second semiconductor layer; forming an etching mask layer on the first current diffusing layer, wherein the etching mask layer have a plurality of hollows; and removing a portion of the first current diffusing layer and a portion of second semiconductor layer and a portion of the active layer to form the hollows in the first current diffusing layer and the second semiconductor layer and the active layer. - View Dependent Claims (24)
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Specification