RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS FOR MANUFACTURING THE SAME
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Abstract
The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.
The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
121 Citations
48 Claims
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1-18. -18. (canceled)
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19. A surface mounted light emitting apparatus comprising:
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a light emitting device, a first resin molding which integrally molds a first lead whereon the light emitting device is mounted and a second lead which is electrically connected to the light emitting device, and a second resin molding which covers the light emitting device, wherein the first resin molding has a recess comprising a bottom surface and a side surface, the first lead is exposed from the bottom surface of the recess of the first resin molding, with the light emitting device being mounted on the exposed portion; and
the first resin molding and the second resin molding are formed from thermosetting resins. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A surface mounted light emitting apparatus comprising:
- a light emitting device,
a first resin molding which integrally molds a first lead whereon the light emitting device is mounted and a second lead which is electrically connected to the light emitting device, and a second resin molding which covers the light emitting device, wherein the first lead has a first inner lead and a first outer lead with the first inner lead having the light emitting device mounted thereon and being electrically connected to a first electrode of the light emitting device, and the first outer lead being exposed from the first resin molding; the second lead has a second inner lead and a second outer lead with the second inner lead being electrically connected to a second electrode of the light emitting device and the second outer lead being exposed from the first resin molding; the first resin molding has a recess comprising a bottom surface and a side surface, the first inner lead is exposed on the bottom surface of the recess of the first resin molding, with the light emitting device being mounted on the exposed portion; and the first resin molding and the second resin molding are formed from thermosetting resins. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
- a light emitting device,
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37. A resin molding which integrally molds a first lead and a second lead, wherein
the first lead has a first inner lead and a first outer lead with the first inner lead being placed in the resin molding and the first outer lead being exposed from the resin molding; -
the second lead has a second inner lead and a second outer lead with the second inner lead being placed in the resin molding and the second outer lead being exposed from the resin molding, the resin molding has a recess comprising a bottom surface and a side face formed therein, and the first inner lead and the second inner lead are exposed from the bottom surface of the recess of the resin molding; and the resin molding is formed from a thermosetting resin. - View Dependent Claims (38, 39, 40, 41)
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42. A resin molding which integrally molds the first lead and the second lead, wherein
the first lead has a first inner lead and a first outer lead with the first inner lead being placed in the resin molding and the first outer lead being exposed from the resin molding, the second lead has a second inner lead and a second outer lead with the second inner lead being placed in the resin molding and the second outer lead being exposed from the resin molding to the outside; -
the resin molding has the recess comprising a bottom surface and a side surface, the first inner lead and the second inner lead are exposed from the bottom surface of the recess of the resin molding, and back side of the first inner lead which is opposite to the principal surface where the recess is formed is exposed from the first resin molding; and the resin molding is formed from a thermosetting resin. - View Dependent Claims (43, 44, 45, 46)
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47. A method for manufacturing a resin molding which integrally molds a first lead and a second lead and has a recess which has a bottom surface and a side surface, the first lead having a first inner lead and a first outer lead, the second lead having a second inner lead and a second outer lead, comprising:
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interposing, between an upper die having a recess corresponding to the recess of the resin molding and a lower die, the first inner lead and the second inner lead corresponding to the bottom surface of the recess of the resin molding and the first outer lead and the second outer lead; pouring the thermosetting resin into the recess formed between the upper die and the lower die by the transfer molding process; and heating the thermosetting resin poured into the recess so as to be cured and form the resin molding.
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48. A method for manufacturing a surface mounted light emitting apparatus including a first resin molding which integrally molds a first lead and a second lead and has a recess which has a bottom surface and a side surface, a light emitting device mounted on the first lead and a second resin molding which covers the light emitting device, the first lead having a first inner lead and a first outer lead, the second lead having a second inner lead and a second outer lead, comprising:
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interposing, between an upper die having a recess corresponding to the recess of the first resin molding and a lower die, the first inner lead and the second inner lead corresponding to the bottom surface of the recess of the first resin molding and the first outer lead and the second outer lead; pouring a first thermosetting resin into the recess formed between the upper die and the lower die by a transfer molding process; heating the first thermosetting resin poured into the recess so as to be cured and form the first resin molding; removing the upper die; mounting the light emitting device on the first inner lead with a first electrode of the light emitting device being electrically connected with the first inner lead and a second electrode of the light emitting device being electrically connected with the second inner lead; placing a second thermosetting resin in the recess where the light emitting device is mounted; and heating the second thermosetting resin so as to be cured and form the second resin molding.
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Specification