ANTI-FAKE PACKAGING MATERIAL OF RFID AND ITS PACKAGING METHOD

• US 20090051540A1
• Filed: 07/21/2008
• Published: 02/26/2009
• Est. Priority Date: 08/22/2007
• Status: Abandoned Application

• Current Assignee: AMOG Technologies Pty Limited
• Original Assignee: AMOG Technologies Pty Limited
• Inventors: Chen, Yao-Jen, FU, I-Ju, Lo, Yung-Chih
• Application Number:
  US12/176,509
• Publication Number:
  US 20090051540A1
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: G06K 19/04 characterised by the shape
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

A RFID packaging material packaging method includes the steps of: providing a substrate having a conductive layer covered thereon, processing the conductive layer of the substrate to form an antenna, electrically connecting a chip to the antenna via a pad, and covering the substrate onto a product for enabling the product to provide a RFID recognition function. The invention relates also to the RFID packaging material made subject to this RFID packaging material packaging method.

Claims

1. A method for anti-fake package of RFID, comprising the steps of:

providing a substrate having a conductive layer covered thereon;

processing said conductive layer to form an antenna;

mounting a RFID chip in said substrate for electrically connecting the chip to said antenna via a pad; and

covering said substrate onto a product.

2. The RFID packaging material packaging method as claimed in claim 1, wherein the metal layer of said substrate is aluminum or tin.

3. The RFID packaging material packaging method as claimed in claim 1, wherein said substrate is an inner packaging material for cigarette package.

4. The RFID packaging material packaging method as claimed in claim 1, wherein said antenna is a slot antenna.

5. The RFID packaging material packaging method as claimed in claim 1, wherein said antenna is formed in said substrate at a predetermined location.

6. The RFID packaging material packaging method as claimed in claim 1, wherein the product into which said substrate is incorporated is a package of cigarettes.

7. The RFID packaging material packaging method as claimed in claim 1, wherein the product into which said substrate is incorporated is a packaged beverage.

8. The RFID packaging material packaging method as claimed in claim 1, wherein the product into which said substrate is incorporated is the cap of a bottle wine.

9. The RFID packaging material packaging method as claimed in claim 1, wherein the step of processing said substrate to form an antenna is to process said substrate through one of trimming process, etching process, stamping process and cutting process subject to a predetermined antenna pattern.

10. An anti-fake package of RFID comprising:

a substrate covered with a conductive layer for packaging a product;

an antenna formed in said substrate; and

a chip electrically connected to said antenna via a pad for receiving and transmitting data.

11. The RFID packaging material as claimed in claim 10, wherein the metal layer of said substrate is aluminum or tin.

12. The RFID packaging material as claimed in claim 10, wherein said substrate is an inner packaging material for cigarette package.

13. The RFID packaging material packaging method as claimed in claim 10, wherein said antenna is a slot antenna.

14. The RFID packaging material packaging method as claimed in claim 10, wherein said chip is a RFID (radio-frequency identification) chip.

15. The RFID packaging material packaging method as claimed in claim 10, wherein said antenna is formed in said substrate at a predetermined location.

16. The RFID packaging material packaging method as claimed in claim 10, wherein said chip is electrically connected to said antenna by an adhesive.

17. The RFID packaging material packaging method as claimed in claim 10, wherein said substrate is adapted to package cigarettes in a cigarette package.

18. The RFID packaging material packaging method as claimed in claim 10, wherein said substrate is for the packaging of beverage.

19. The RFID packaging material packaging method as claimed in claim 10, wherein said substrate is incorporated into the cap of a bottle wine.

20. The RFID packaging material packaging method as claimed in claim 10, wherein said antenna is formed in said substrate through one of trimming process, etching process, stamping process and cutting process.