CASE STRUCTURE HAVING CONDUCTIVE PATTERN AND METHOD OF MANUFACTURING THE SAME

• US 20090051602A1
• Filed: 08/04/2008
• Published: 02/26/2009
• Est. Priority Date: 08/22/2007
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Bae, Sang Woo, Sung, Jae Suk, Jeon, Dae Seong
• Granted Patent: US 7,940,220 B2
• Time in Patent Office: Days
• US Class Current: 343/700.R
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 3/426 initial plating of through-holes in substrates without metal
• CPC Class Codes: H05K 9/0045 being rigid plastic containers having a coating of shielding material

Abstract

There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.

Claims

1. A case structure having a conductive pattern, the case structure comprising:

a case having at least one via hole formed therein;

at least conductive pattern formed on an outer surface of the case; and

a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.

2. The case structure of claim 1, wherein a portion of the outer surface of the case where the conductive pattern is formed, and a wall surface of the via hole where the conductive via is formed are formed of a platable material.

3. The case structure of claim 1, wherein the case comprises a protrusion protruding toward the board mounted on the inside of the case, and

the via hole is formed in the protrusion.

4. The case structure of claim 1, wherein the at least one conductive pattern comprises an antenna pattern.

5. The case structure of claim 1, wherein the conductive via has one end exposed to the inner surface of the case.

6. The case structure of claim 1, wherein the conductive via and the conductive pattern electrically connected to each other are formed integrally with each other.

7. A method of manufacturing a case structure having a conductive pattern, the method comprising:

forming a case having at least one via hole formed therein;

forming a conductive via within the at least one via hole; and

forming at least one conductive pattern on an outer surface of the case so that the conductive pattern is connected to the conductive via.

8. The method of claim 7, wherein the forming a case comprises:

performing injection molding to form a first region that is a portion of the case by using a non-platable material; and

performing injection molding to form a second region at a portion of the first region by a platable material.

9. The method of claim 8, wherein a portion of the outer surface of the case where the conductive pattern is formed, and a wall surface of the via hole where the conductive via is formed are injection-molded by using the platable material.

10. The method of claim 9, wherein the forming a conductive via and the forming at least one conductive pattern comprise plating the second region.

11. The method of claim 10, wherein the forming a conductive via and the forming at least one conductive pattern are performed at the same time.

12. The method of claim 7, wherein the forming a conductive via comprises plating the wall surface of the via hole.

13. The method of claim 7, wherein the forming at least one conductive pattern comprises:

forming a plating film on the outer surface of the case; and

removing a portion of the plating film.

14. The method of claim 13, wherein the forming a plating film on the outer surface of the case is performed at the same time as the forming a conductive via, and

the forming a conductive via comprises plating the wall surface of the via hole.

15. The method of claim 13, wherein the removing a portion of the plating film is performed by a cutting process or an etching process.

16. A method of forming a case structure having a conductive pattern, the method comprising:

forming a case;

forming a plating film on at least one surface of the case; and

removing a portion of the plating film to form at least one conductive pattern.

17. The method of claim 16, wherein the at least one conductive pattern comprises an antenna pattern.

18. The method of claim 16, wherein the removing a portion of the plating film is performed by using a cutting process or an etching process.