MIRROR REFLECTIVE ELEMENT ASSEMBLY

• US 20090052003A1
• Filed: 10/29/2008
• Published: 02/26/2009
• Est. Priority Date: 10/02/2003
• Status: Abandoned Application

• Current Assignee: Donnelly Corporation (Magna International Incorporated)
• Original Assignee: Donnelly Corporation (Magna International Incorporated)
• Inventors: Wight, David C., Schofield, Kenneth, Kramer, Mark E.
• Application Number:
  US12/260,499
• Publication Number:
  US 20090052003A1
• Time in Patent Office: Days
• US Class Current: 359/267
• CPC Class Codes: B32B 37/1292 selectively, e.g. in stripes, in patterns B32B37/0076 takes precedence
• CPC Class Codes: B60R 1/088 using a cell of electrically changeable optical characteristic, e.g. liquid-crystal or electrochromic mirrors
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

A reflective element assembly for a mirror assembly of a vehicle includes a reflective element substrate and a conductive trace or layer disposed at a rear surface of the reflective element substrate. A non-conductive layer is applied at the conductive layer and covers at least a portion of the conductive layer and leaves at least some portions of the conductive layer exposed. At least one circuitry component is applied to at least one of the portions of the conductive layer.

Claims

1. A reflective element assembly for a mirror assembly of a vehicle, said reflective element comprising:

a reflective element substrate having a rear surface and a front surface;

a conductive layer disposed at said rear surface of said reflective element substrate;

a non-conductive layer applied at said conductive layer and covering at least a portion of said conductive layer and leaving at least one portion of said conductive layer exposed; and

at least one circuitry component applied to at least one portion of said conductive layer.