Configuration of multiple LED modules

• US 20090052178A1
• Filed: 10/20/2008
• Published: 02/26/2009
• Est. Priority Date: 10/16/2000
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Gunter Waitl, Werner Marchl, Werner Spath
• Inventors: Spath, Werner, Marchl, Werner, Waitl, Gunter
• Granted Patent: US 7,862,211 B2
• Time in Patent Office: Days
• US Class Current: 362/249.20
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Claims

1. A configuration of multiple modules, comprising:

a plurality of LED modules each containing;

a carrier having a first main area, a second main area, and at least one semiconductor layer, said first main area having a planar configuration;

a plurality of LED semiconductor bodies applied on said first main area of said carrier; and

a common heat sink, said carrier of each of said plural LED modules being connected to said common heat sink on said second main area.

2. The configuration of multiple modules according to claim 1, wherein said common heat sink is formed of a material selected from the group consisting of copper and aluminum.

3. The configuration of multiple modules according to claim 1, wherein said semiconductor layer of each of said plural LED modules adjoins said common heat sink.

4. The configuration of multiple modules according to claim 3, wherein said semiconductor layer of each of said LED modules is connected to said common heat sink by one of a soldering compound and a thermally conductive adhesive.

5. The configuration of multiple modules according to claim 1, further comprising conductor tracks disposed between said plural LED modules.

6. The configuration of multiple modules according to claim 5, further comprising a conductor track carrier bearing on said common heat sink, wherein said conductor tracks are formed on said conductor track carrier.

7. The configuration of multiple modules according to claim 6, wherein said conductor track carrier is selected from the group consisting of printed circuit boards, flexible printed circuit boards, printed circuit board sheets and flex-boards.