METHOD OF RECYCLING ABRASIVE SLURRY
First Claim
1. A method of recycling an abrasive slurry for recycling a slurry containing colloidal silica, the slurry being a used slurry having been used in polishing semiconductor wafer(s), the method comprising:
- adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled;
irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and
removing a foreign substance contained in the used slurry having been irradiated with the ultrasound, the foreign substance being removed by a filter.
1 Assignment
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Accused Products
Abstract
A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and, by using a filter, removing a foreign substance contained in the used slurry having been irradiated with the ultrasound.
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Citations
6 Claims
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1. A method of recycling an abrasive slurry for recycling a slurry containing colloidal silica, the slurry being a used slurry having been used in polishing semiconductor wafer(s), the method comprising:
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adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and removing a foreign substance contained in the used slurry having been irradiated with the ultrasound, the foreign substance being removed by a filter. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification