ELECTROSTATIC CHUCK MEMBER, METHOD OF MANUFACTURING THE SAME, AND ELECTROSTATIC CHUCK DEVICE

• US 20090056112A1
• Filed: 08/29/2008
• Published: 03/05/2009
• Est. Priority Date: 09/03/2007
• Status: Abandoned Application

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Kobayashi, Hiroyuki
• Application Number:
  US12/201,392
• Publication Number:
  US 20090056112A1
• Time in Patent Office: Days
• US Class Current: 29/739
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

A plurality of protruded portions is formed through embossing and is distributed and arranged regularly or irregularly on an electrostatic chuck surface, and has a circular or almost circular top surface shape and a roundness (R) of 0.01 mm or more is applied to an edge part defined by an intersection of the top surface and a side surface and a portion to which the roundness is applied occupies a quarter of a height h of the protruded portion or more.

Claims

1. An electrostatic chuck member to be used for holding a substance to be processed in a manufacture of a semiconductor device, comprising:

a base material, and

a plurality of protruded portions formed on an electrostatic chuck surface of the base material through embossing, wherein

the protruded portion is distributed and arranged regularly or irregularly on the electrostatic chuck surface and has a circular or almost circular top surface shape,

a roundness (R) of 0.01 mm or more is applied to an edge part defined by an intersection of the top surface and a side surface, and

a portion to which the roundness is applied occupies a quarter of a height (h) of the protruded portion or more, and

the roundness is applied by smoothing the edge part of the protruded portion through a post-processing including polishing or blasting after forming the protruded portion on the electrostatic chuck surface through the embossing, or is applied by smoothing the edge part of the protruded portion when forming the protruded portion on the electrostatic chuck surface through the embossing.

2. The electrostatic chuck member according to claim 1, wherein

the top surface of the protruded portion has a diameter of 0.2 to 2 mm and a height of 0.01 to 0.03 mm.

3. The electrostatic chuck member according to claim 1, wherein

the base material is formed of a metal or ceramic.

4. The electrostatic chuck member according to claim 1, wherein

the base material is formed of alumina ceramic.

5. A method of manufacturing the electrostatic chuck member according to claim 1, comprising the steps of:

smoothing an edge part of the protruded portion under presence of masking unit, and

applying a roundness (R) to the edge part, wherein

the roundness is applied to the edge part of the protruded portion through a post-processing including polishing or blasting after forming the protruded portion on the electrostatic chuck surface through embossing, or is applied to the edge part of the protruded portion when forming the protruded portion on the electrostatic chuck surface through the embossing.

6. The manufacturing method according to claim 5, wherein

after forming the protruded portion on the electrostatic chuck surface through the embossing,

the edge part of the protruded portion is processed with a softer grinding material than the electrostatic chuck member under presence or non-presence of the masking unit for protecting at least a central part of a top surface of the protruded portion to apply the roundness.

7. The manufacturing method according to claim 5, wherein

after forming the protruded portion on the electrostatic chuck surface through the embossing, the edge part of the protruded portion is processed with a grinding material constituted by finer abrasive grains than a grinding material used in the embossing under presence or non-presence of the masking unit for protecting at least a central part of a top surface of the protruded portion to apply the roundness.

8. The manufacturing method according to claim 5, wherein

when forming the protruded portion on the electrostatic chuck surface through the embossing, the protruded portion is processed with a grinding material having a grain size of 250 to 44 μ

m in a state in which the edge part is exposed under presence of negative type masking unit corresponding to a top surface of the protruded portion to be formed to apply the roundness.

9. The manufacturing method according to claim 5, wherein

the embossing is carried out through sand blasting.

10. An electrostatic chuck device comprising:

the electrostatic chuck member described in claim 1, and

a substrate including the electrostatic chuck member with an electrostatic chuck surface exposed from an upper surface.