INTEGRATED MINIATURE DEVICE FACTORY

• US 20090056116A1
• Filed: 08/07/2008
• Published: 03/05/2009
• Est. Priority Date: 08/07/2007
• Status: Abandoned Application

• Current Assignee: Micro Foundry Inc.
• Original Assignee: Micro Foundry Inc.
• Inventors: Miller, Jeffrey N., Presley, Bryan S.
• Application Number:
  US12/187,780
• Publication Number:
  US 20090056116A1
• Time in Patent Office: Days
• US Class Current: 29/791
• CPC Class Codes: B81C 99/002 Apparatus for assembling MEMS, e.g. micromanipulators micromanipulators per se B25J7/00
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: Y10T 29/534 Multiple station assembly or disassembly apparatus

Abstract

An integrated miniature factory for fabrication of a device is provided. In one example, the factory includes two enclosures that can be adapted for stand-alone operation. Compartmentalized process modules are configured to removably couple to each of the enclosures. Each compartmentalized process module is sized to receive a substrate on which the device is to be fabricated and is configured to aid in fabrication of the device. The two enclosures are also adaptable to be coupled to one another. A transportation mechanism configured to transfer the substrate between the compartmentalized process modules in one of the enclosures may also be configured to transfer the substrate between the two enclosures.

Claims

1. An integrated miniature factory for fabrication of a device, comprising:

a first enclosure adaptable for stand-alone operation;

a plurality of first compartmentalized process modules configured to removably couple to the first enclosure, wherein each of the first compartmentalized process modules are sized to receive a substrate on which the device is to be fabricated, and wherein each of the first compartmentalized process modules are configured to aid in fabrication of the device;

a transportation mechanism configured to transfer the substrate between at least two of the first compartmentalized process modules during a fabrication process;

a second enclosure adaptable for stand-alone operation; and

a plurality of second compartmentalized process modules configured to removably couple to the second enclosure, wherein each of the second compartmentalized process modules are sized to receive the substrate, and wherein each of the second compartmentalized process modules are configured to aid in fabrication of the device,

wherein the second enclosure is also adaptable for coupling to the first enclosure, and wherein the transportation mechanism is configurable for moving the device between the first compartmentalized process modules of the first enclosure and the second compartmentalized process modules of the second enclosure.

2. The integrated miniature factory of claim 1 wherein at least one of the first and second enclosures includes a filter covering an air intake to create a substantially particle-free environment containing the plurality of first and second compartmentalized process modules, respectively, within the enclosure.

3. The integrated miniature factory of claim 1 wherein each of the plurality of first and second compartmentalized process modules forms a substantially particle-free enclosure.

4. The integrated miniature factory of claim 1 wherein at least some of the plurality of first and second compartmentalized process modules are rectangular in shape.

5. The integrated miniature factory of claim 1 wherein at least some of the plurality of first and second compartmentalized process modules are cylindrical in shape.

6. The integrated miniature factory of claim 1 wherein at least some of the first and second compartmentalized process modules are configured to reside in apertures located in a side wall of the respective first or second enclosures.

7. The integrated miniature factory of claim 6 wherein each aperture is associated with a mounting feature configured to engage a corresponding mounting feature on each of the plurality of first and second compartmentalized process modules.