Microfluidic Pump and Valve Structures and Fabrication Methods

• US 20090056861A1
• Filed: 10/09/2008
• Published: 03/05/2009
• Est. Priority Date: 10/13/2004
• Status: Active Grant

• Current Assignee: Rheonix, Inc.
• Original Assignee: Kionix Incorporated (ROHM Co., Ltd.)
• Inventors: Young, Lincoln C., Zhou, Peng
• Granted Patent: US 8,293,053 B2
• Time in Patent Office: Days
• US Class Current: 156/221
• CPC Class Codes: B01F 2101/2202 Mixing compositions or mixers in the medical or veterinary field
• CPC Class Codes: B01F 25/451 characterised by means for moving the materials to be mixed or the mixture
• CPC Class Codes: B01F 25/4521 the components being pressed through orifices in elements, e.g. flat plates or cylinders, which obstruct the whole diameter of the tube
• CPC Class Codes: B01F 31/65 the materials to be mixed being directly submitted to a pulsating movement, e.g. by means of an oscillating piston or air column
• CPC Class Codes: B01F 33/30 Micromixers
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0861 Configuration of multiple channels and/or chambers in a single devices
• CPC Class Codes: B01L 2300/0867 Multiple inlets and one sample wells, e.g. mixing, dilution
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2400/0481 squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0487 fluid pressure, pneumatics
• CPC Class Codes: B01L 2400/06 Valves, specific forms thereof
• CPC Class Codes: B01L 2400/0638 membrane valves, flap valves
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 2400/084 Passive control of flow resistance
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B29C 65/4895 Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
• CPC Class Codes: B29C 66/004 : Preventing sticking together, e.g. of some areas of the parts to be joined
• CPC Class Codes: B29C 66/54 : Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
• CPC Class Codes: B29C 66/5412 : said substantially flat extra element being flexible, e.g. a membrane B29C66/5416 takes precedence
• CPC Class Codes: B29C 66/71 : characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29K 2025/00 : Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
• CPC Class Codes: B29K 2025/04 : Polymers of styrene
• CPC Class Codes: B29K 2025/06 : PS, i.e. polystyrene
• CPC Class Codes: B29K 2033/08 : Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
• CPC Class Codes: B29K 2033/12 : Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
• CPC Class Codes: B29K 2069/00 : Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2101/12 : Thermoplastic materials
• CPC Class Codes: B29L 2031/7496 : Pumps
• CPC Class Codes: B29L 2031/7506 : Valves
• CPC Class Codes: B29L 2031/756 : Microarticles, nanoarticles
• CPC Class Codes: B81B 2201/036 : Micropumps
• CPC Class Codes: B81B 2201/054 : Microvalves
• CPC Class Codes: B81B 2203/0127 : Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 3/0021 : Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 1/00103 : Structures having a predefined profile, e.g. sloped or rounded grooves
• CPC Class Codes: B81C 1/00158 : Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: F04B 43/028 : with in- or outlet valve arranged in the plate-like flexible member valve arranged in the piston F04B53/12
• CPC Class Codes: F04B 43/06 : Pumps having fluid drive
• CPC Class Codes: F15C 1/08 : Boundary-layer devices, e.g. wall-attachment amplifiers coanda effect fluid oscillators of pulse generators F15B21/12
• CPC Class Codes: F16K 2099/0074 : using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0076 : using electrical discharge machining [EDM], milling or drilling
• CPC Class Codes: F16K 2099/0078 : using moulding or stamping
• CPC Class Codes: F16K 2099/008 : Multi-layer fabrications
• CPC Class Codes: F16K 2099/0084 : Chemistry or biology, e.g. "lab-on-a-chip" technology
• CPC Class Codes: F16K 2099/0094 : Micropumps
• CPC Class Codes: F16K 7/12 : with flat, dished, or bowl-shaped diaphragm
• CPC Class Codes: F16K 99/0001 : Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 : Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0021 : No-moving-parts valves
• CPC Class Codes: F16K 99/0034 : Operating means specially adapted for microvalves
• CPC Class Codes: F16K 99/0055 : actuated by fluids
• CPC Class Codes: F16K 99/0057 : the fluid being the circulating fluid itself, e.g. check valves
• CPC Class Codes: F16K 99/0059 : actuated by a pilot fluid
• CPC Class Codes: Y10T 137/212 : System comprising plural fluidic devices or stages
• CPC Class Codes: Y10T 137/2202 : By movable element
• CPC Class Codes: Y10T 137/2218 : Means [e.g., valve] in control input
• CPC Class Codes: Y10T 137/8593 : Systems
• CPC Class Codes: Y10T 137/85978 : With pump
• CPC Class Codes: Y10T 156/1002 : with permanent bending or reshaping or surface deformation of self sustaining lamina
• CPC Class Codes: Y10T 156/1043 : Subsequent to assembly
• CPC Class Codes: Y10T 29/49405 : Valve or choke making

Abstract

Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

Claims

1. A method for making an active microfluidic device including at least one planar substrate and a deformable membrane, comprising the steps of:

deforming at least a portion of the membrane out of the plane of the substrate.

contacting the non-deformed portion of the membrane and a bonding surface of the substrate; and

applying a bonding agent to an interface between the substrate and the non-deformed portion of the membrane to be attached thereto;

2. The method of claim 1, further comprising, applying a curable bonding agent to the interface between the substrate and the non-deformed portion of the membrane.

3. The method of claim 1, wherein the step of deforming at least a portion of the membrane out of the plane of the substrate comprises physically contacting the at least a portion of the membrane and pulling it away from the substrate.

4. The method of claim 1, wherein the step of deforming at least a portion of the membrane out of the plane of the substrate comprises physically contacting the at least a portion of the membrane and pushing it towards the substrate.

5. The method of claim 1, further comprising, providing a transverse through-hole in the substrate.

6. The method of claim 1, wherein the step of deforming at least a portion of the membrane out of the plane of the substrate comprises applying at least one of a pneumatic and a hydraulic pressure to the at least a portion of the membrane and pulling it away from the substrate.

7. The method of claim 1, wherein the step of deforming at least a portion of the membrane out of the plane of the substrate comprises applying at least one of a pneumatic and a hydraulic pressure to the at least a portion of the membrane and pushing it towards the substrate.

8. The method of claim 1, wherein the step of deforming at least a portion of the membrane out of the plane of the substrate comprises applying at least one of a pneumatic and a hydraulic pressure to the at least a portion of the membrane, further comprising applying a pressure in the range between about negative 14 to positive 50 pounds per square inch (psi).

9. The method of claim 7, comprising applying a negative pressure in the range between about negative 14 to negative 1 psi.

10. The method of claim 7, comprising applying a positive pressure in the range between about 1 to 25 psi.

11. The method of claim 1, further comprising, bonding at least a second substrate to at least a portion of an exposed surface of the non-deformed portion of the membrane.

12. The method of claim 11, further comprising, providing a transverse through-hole in the at least the second substrate.

13. The method of claim 12, further comprising deforming the at least a portion of the membrane out of the plane of the substrate by applying at least one of a pneumatic and a hydraulic pressure to the at least a portion of the membrane via the through-hole.

14. The method of claim 2, further comprising, in recited order,

applying the bonding agent to the interface between the substrate and the membrane;

contacting the membrane and the bonding surface of the substrate;

deforming at least a portion of the membrane out of the plane of the substrate; and

curing the bonding agent.

15. The method of claim 2, further comprising, in recited order,

contacting the membrane and the bonding surface of the substrate;

applying the bonding agent to the interface between the substrate and the membrane;

deforming at least a portion of the membrane out of the plane of the substrate; and

curing the bonding agent.

16. The method of claim 1, further comprising, in recited order,

contacting the membrane and the bonding surface of the substrate;

deforming at least a portion of the membrane; and

applying the bonding agent to the interface between the substrate and the membrane.

17. A method for making an active microfluidic device including at least one planar substrate and a deformable membrane, comprising, in recited order, the steps of:

applying a curable bonding agent to the interface between the substrate and the membrane;

contacting the membrane and the bonding surface of the substrate;

deforming at least a portion of the membrane out of the plane of the substrate; and

setting the bonding agent.

18. A method for making an active microfluidic device including at least one planar substrate and a deformable membrane, comprising, in recited order, the steps of:

contacting the membrane and the bonding surface of the substrate;

applying a curable bonding agent to the interface between the substrate and the membrane;

deforming at least a portion of the membrane out of the plane of the substrate; and

curing the bonding agent.

19. A method for making an active microfluidic device including at least one planar substrate and a deformable membrane, comprising, in recited order, the steps of:

contacting the membrane and the bonding surface of the substrate;

deforming at least a portion of the membrane; and

applying the bonding agent to the interface between the substrate and the membrane.