PACKAGE FOR A MICRO-ELECTRO MECHANICAL DEVICE

• US 20090057790A1
• Filed: 10/31/2008
• Published: 03/05/2009
• Est. Priority Date: 02/09/2004
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Kane, John, Qi, Quan, Michael, Don, Sterner, John R., Haluzak, Charles Craig, Rossman, Mari J., Bower, Bradley
• Granted Patent: US 9,006,877 B2
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate

Abstract

A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

Claims

1-56. -56. (canceled)

57. A package for a micro-electromechanical device (MEMS package), comprising:

an inner enclosure having an inner cavity defined therein;

a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity; and

a locking feature disposed within the fill port channel creating a variable cross section in the fill port channel.

58. The MEMS package of claim 57, the fill port channel being external to the inner enclosure.

59. The MEMS package of claim 57, the locking feature comprising an island in the fill port channel.

60. The MEMS package of claim 59, the island being defined by a delta-shaped cross section.

61. The MEMS package of claim 57, the locking feature comprising a plurality of islands in the fill port channel.

62. The MEMS package of claim 57 further comprising a plurality of locking feature groups disposed within the fill port channel, wherein the locking feature groups comprise varying sizes of locking features configured to prevent contaminants from reaching the inner cavity.

63. The MEMS package of claim 62, the locking feature groups comprising a first locking feature group having locking features of a first size, a second locking feature group having locking features of a second size being smaller than the first size, and a third locking feature group having a locking features of a third size being smaller than the second size.

64. The MEMS package of claim 63, the locking features of the first locking feature group and the second locking feature group and the third locking feature group defined by respective islands.

65. A package for a micro-electromechanical device (MEMS package), comprising:

an inner enclosure having an inner cavity defined therein; and

a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity, the fill port channel following a tortuous path.

66. The MEMS package of claim 65, the tortuous path comprising a serpentine path.

67. The MEMS package of claim 65, the tortuous path comprising a curvaceous path.

68. A package for a micro-electromechanical device (MEMS package), comprising:

an inner enclosure having an inner cavity defined therein;

a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity; and

a flow control structure extending at least partially into the inner enclosure, the flow control structure preventing the adhesive from entering the cavity by physically separating the fill port channel from the inner cavity.

69. The MEMS package of claim 68, further comprising locking features formed on the flow control structure, the locking features causing the fill port channel to have a variable cross section.

70. The MEMS package of claim 69, the locking features comprising stepped sections to form a choke point in the fill port channel.

71. The MEMS package of claim 69, wherein the flow control structure comprises a peninsula.