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INTERCONNECT IN A MULTI-ELEMENT PACKAGE

  • US 20090057849A1
  • Filed: 08/29/2007
  • Published: 03/05/2009
  • Est. Priority Date: 08/29/2007
  • Status: Active Grant
First Claim
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1. A packaged semiconductor device comprising:

  • an interconnect layer over a first side of a polymer layer;

    a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer;

    a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side; and

    a connector block within the polymer layer, having at least one electrical path extending from a first surface of the connector block to a second surface of the connector block, and electrically coupling the interconnect layer to the first conductive element through the at least one electrical path.

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