Electronic component and method for fixing the same

• US 20090058590A1
• Filed: 05/05/2006
• Published: 03/05/2009
• Est. Priority Date: 05/13/2005
• Status: Active Grant

• Current Assignee: Wurth elektronik eisos gmbh & co. kg
• Original Assignee: Wurth elektronik eisos gmbh & co. kg
• Inventors: Aumueller, Rupert
• Granted Patent: US 7,973,634 B2
• Time in Patent Office: Days
• US Class Current: 336/205
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence
• CPC Class Codes: H01Q 7/08 Ferrite rod or like elongated core
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/4922 with molding of insulation

Abstract

Disclosed is an electronic component, especially a coil with a coil core, in which the turns of the coil winding are spaced apart from each other at least at one point in the longitudinal direction of the coil. A plastic retaining element which overlaps both the coil core and at least the two adjacent turns of the coil winding in a longitudinal direction is sprayed on in the area of said point, whereby a connection between the coil core and the coil winding is created at the same time. The retaining element can be sprayed around a closed circumference of the coil while covering only a portion of the coil in the longitudinal direction thereof. Preferably, the retaining element is placed approximately in the center relative to the longitudinal extension of the coil.

Claims

1. An electronic component which

is formed for automatic mounting and

features a holding element (8, 18, 28) which

is made of plastic and

is injection molded on the electronic component and

is formed as a holding point for a grasper.

2. A component according to claim 1 , formed as coil with a coil core (1) and the coil winding (3) surrounds the coil core (1) with at least two connection ends (5, 6).

3. A component according to claim 2, wherein the holding element (8, 18, 28) grips both the coil core (1) as well as at least a point of awinding (4) of the coil winding (3).

4. A component according to claim 2, wherein at least at one point (7) a gap is provided between two adjacent windings (4) of the coil winding (3) in the longitudinal direction of the coil, whereby the holding element (8, 18) is injection molded on the coil core (1) at the point (7) of the gap between the windings (4) and at least two of these points (7) overlap with adjacent windings (4) of the coil winding (3) in the longitudinal direction.

5. A component according to claim 1, wherein the holding element (8, 18) is located on the side of the coil turned away from the assembly side of the coil.

6. A component according to claim 1, wherein the holding element (8, 18) extends over at least one part of the circumference of the component.

7. A component according to claim 1, wherein the holding element (8, 18) extends over at least one part of the circumference of the component.

8. A component according to claim 1, wherein the holding element (18) extends over the entire circumference of the component.

9. A component according to claim 1, wherein the holding element (8, 18) features a plane surface (9) on the side of the component turned away from the assembly side.

10. A component according to claim 1, wherein the holding element (8, 18) is injection molded from plastic that develops an adhesive effect at soldering temperatures.

14. A method according to claim 1, wherein the holding element (8, 18) is injection molded over at least one part of the circumference of the component.

11. A method for mounting an electronic component, wherein

on the electronic component a holding element (8, 18, and 28) is injection molded,

on the holding element a contact surface for a grasper is formed and

that a component with the help of a grasper acting on the contact surface moves said component to its assembly point.

12. A method according to claim 11, wherein for mounting of a component formed as a coil with a coil core (1), the windings (4) of the coil winding at least at one point (7) are provided with a gap in which the coil winding (3) of the coil core (1) is inserted, the coil core (1) and coil winding (3) are introduced in an injection die, and on the point (7) of the gap between the two windings (4) and the two windings (4) the holding element (8, 18) itself is injection molded.

13. A method according to claim 11, wherein the holding element (8, 18) is injection molded on the side of the component turned away from the assembly side of the component.

15. A method according to claim 11, wherein the holding element (8, 18) is injection molded over only one part of the length of the component.

16. A method according to claim 11, wherein the holding element (18) is injection molded around the entire circumference of the component.

17. A method according to claim 11, wherein the holding element (8, 18) is provided with a plane surface (9) on the side turned away from the assembly side of the component.

18. A method according to claim 11, wherein the holding element is injection molded from plastic that develops an adhesive effect at a temperature corresponding to the soldering temperature.