HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION

• US 20090059588A1
• Filed: 08/26/2008
• Published: 03/05/2009
• Est. Priority Date: 08/30/2007
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Oswald, Florin, Engl, Moritz
• Granted Patent: US 8,220,973 B2
• Time in Patent Office: Days
• US Class Current: 362/249.20
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.

Claims

1. A housing comprising:

a housing underpart;

a housing cavity defined within the housing underpart;

the housing cavity having an opening extending through one side of the housing;

at least one electromagnetic radiation emitting semiconductor chip disposed in the housing cavity; and

a transparent cover that covers the housing cavity, the cover connected to the housing underpart in such a way that the electromagnetic radiation exiting from the side surfaces of the cover is absorbed.

2. The housing as in claim 1, wherein the housing comprises an absorptive material placed in such a way that the absorptive material absorbs the radiation emitted from the side surface of the cover.

3. The housing as in claim 2, wherein the housing underpart comprises at least one housing base and one housing frame, and the housing frame contains a frame recess in which the cover is disposed, the cover connected to the housing frame by an absorptive adhesive.

4. The housing as in claim 3, wherein the absorptive material is disposed between the side surface of the cover and the housing frame.

5. The housing as in claim 3, wherein the height of the cover is equal to or less than the height of the frame recess.

6. The housing as in claim 3, wherein an edge region of a top side of the cover opposite to the housing cavity is coated with an absorptive layer.

7. The housing as in claim 1, wherein the housing underpart comprises at least one housing base and one housing frame and the housing frame contains a frame recess in which the cover is disposed, the absorptive material being disposed between the side surface of the cover and the housing frame and the absorptive material being an adhesive that produces a mechanical connection between the cover and the housing underpart.

8. The housing as in claim 3, wherein the side surfaces of the cover are coated with an absorptive layer.

9. The housing as in claim 1, wherein the cover is optically coupled to the housing underpart.

10. The housing as in claim 1, wherein the cover material is a glass or a cured silicone and is thermally resistant to the radiation from the semiconductor chip.

11. The housing as in claim 3, wherein the material of the housing frame and of the housing base is a ceramic or a synthetic material that is thermally resistant to the radiation from the semiconductor chip.

12. The housing as in claim 1, wherein material of the housing underpart comprises aluminum nitride.

13. The housing as in claim 3, wherein material of the housing frame comprises aluminum oxide and material of the housing base comprises aluminum nitride.

14. The housing as in claim 1, wherein the side surfaces of the cover are ground at an angle such that the radiation coupled into the cover is deflected into the housing underpart.

15. The housing as in claim 14, wherein the side surfaces of the cover are coated with an absorptive layer.

20. The housing as in claim 1, wherein the side surfaces of the cover are ground at an angle such that the radiation coupled into the cover is deflected into the body.

16. A housing comprising:

an body defining an internal cavity and an opening extending from the internal cavity to an outer surface of the body;

at least one electromagnetic radiation emitting semiconductor chip disposed in the cavity;

a transparent cover attached to the body extending across the opening such that electromagnetic radiation exiting from side surfaces of the cover is absorbed by other components of the housing.

17. The housing as in claim 16, wherein the body defines a recess in which the cover is disposed, the cover having a height that is equal to or less than a height of the recess, the cover connected to the housing frame by an absorptive adhesive that limits the optical coupling of light emitted by the semiconductor chip into the cover.

18. The housing as in claim 16, comprising an absorptive material placed between the body and cover in such a way that the absorptive material absorbs the radiation emitted from the side surface of the cover.

19. The housing as in claim 18, wherein the absorptive material is disposed between the side surface of the cover and the housing frame and an edge region of a side of the cover opposite to the housing cavity is coated with an absorptive layer.