Laser circuit etching by subtractive deposition

• US 20090061112A1
• Filed: 08/27/2007
• Published: 03/05/2009
• Est. Priority Date: 08/27/2007
• Status: Abandoned Application

• Current Assignee: Mu-Gahat Holdings Inc.
• Original Assignee: Mu-Gahat Enterprises LLC
• Inventors: Kirmeier, Josef
• Application Number:
  US11/895,766
• Publication Number:
  US 20090061112A1
• Time in Patent Office: Days
• US Class Current: 427/596
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer

Abstract

In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. The ablated metal becomes deposited to form circuit structures on a target structure.

Claims

1. A method of depositing metal structures, said method comprising the steps of:

providing a coated sheet, said coated sheet having a first side that comprises a dielectric substrate and a second side that comprises a metal;

providing a target structure; and

controlling a laser to generate a laser beam toward said first side of said coated sheet such that said laser beam passes through said first side, ablates portions of said second side, and deposits circuit structures on said target structure.

2. The method of claim 1, further comprising:

configuring said coated sheet into a tape;

mounting said tape into a reel-to-reel transport system; and

controlling said reel-to-reel transport system to move said tape relative to said laser.

3. The method of claim 1, further comprising:

moving a mirror in a path of said laser beam to provide for transverse movement of said laser beam across said coated sheet.

4. The method of claim 1, further comprising:

heating said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

5. The method of claim 1, further comprising:

mechanically stressing said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

6. The method of claim 1, further comprising:

cooling said coated sheet, in order to reduce an amount of laser power needed to ablate said metal.

7. The method of claim 1, wherein said coated sheet further comprises a laser energy absorbing material between said dielectric substrate and said metal, wherein said laser energy absorbing material assists in ablation of said metal from said second side.

8. An apparatus including a flexible circuit etching system, said flexible circuit etching system comprising:

a reel-to-reel tape system that linearly presents a coated tape, wherein said coated tape has a first side that comprises a dielectric substrate and a second side that comprises a metal;

a laser that generates a laser beam having a power sufficient to ablate said metal from said second side of said coated tape; and

a mirror that controllably moves to direct said laser beam toward said first side of said coated tape such that said laser beam passes through said first side, ablates portions of said second side, and deposits circuit structures on a target structure.

9. The apparatus of claim 8, further comprising:

a control system, coupled to said reel-to-reel tape system, to said laser, and to said mirror, that controls said reel-to-reel tape system, said laser, and said mirror,

wherein said control system controls said reel-to-reel tape system and said mirror to coordinate appropriate placement of said coated tape in accordance with control of said laser.

10. An apparatus including a laser ablation machine for patterning metal onto a target, said laser ablation machine comprising:

a laser; and

a patterning control system that positions said laser in relation to a coated sheet, wherein said coated sheet has a first side that comprises a dielectric substrate and a second side that comprises a metal,

wherein said laser generates a laser beam having a power sufficient to ablate said metal from said second side of said coated sheet, and wherein said laser beam passes through said first side, ablates portions of said second side, and deposits circuit structures on a target structure.

11. The apparatus of claim 10, further comprising:

a control system, coupled to said laser and to said patterning control system, that controls said laser and said patterning control system,

wherein said control system controls said patterning control system to coordinate appropriate placement of said laser in relation to said coated sheet in accordance with control of said laser.

12. An apparatus including an electrical circuit, said electrical circuit produced by a method comprising the steps of:

providing a coated sheet, said coated sheet having a first side that comprises a dielectric substrate and a second side that comprises a metal;

providing a target structure; and

controlling a laser to generate a laser beam toward said first side of said coated sheet such that said laser beam passes through said first side, ablates portions of said second side, and deposits said portions having been ablated to form said electrical circuit on said target structure.

13. The apparatus of claim 12, wherein said electrical circuit comprises an antenna for a radio frequency identification (RFID) tag.

14. The apparatus of claim 12, wherein said electrical circuit comprises a thermal circuit.