Laser circuit etching by additive deposition

• US 20090061251A1
• Filed: 08/27/2007
• Published: 03/05/2009
• Est. Priority Date: 08/27/2007
• Status: Abandoned Application

• Current Assignee: Mu-Gahat Enterprises LLC
• Original Assignee: Mu-Gahat Enterprises LLC
• Inventors: Kirmeier, Josef
• Application Number:
  US11/895,765
• Publication Number:
  US 20090061251A1
• Time in Patent Office: Days
• US Class Current: 428/615
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/1121 Cooling, e.g. specific areas of a PCB being cooled during reflow soldering details related to cooling of mounted components H05K1/0203
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Abstract

In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents a metal tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the structural integrity of the tape. The ablated metal becomes deposited to form circuit structures on a target structure.

Claims

1. A method of depositing metal structures, said method comprising the steps of:

providing a metal sheet;

providing a target structure; and

controlling a laser to generate a laser beam toward said metal sheet such that said laser beam ablates portions of said metal sheet and deposits circuit structures on said target structure.

2. The method of claim 1, further comprising:

configuring said metal sheet into a tape;

mounting said tape into a reel-to-reel transport system; and

controlling said reel-to-reel transport system to move said tape relative to said laser.

3. The method of claim 1, further comprising:

moving a mirror in a path of said laser beam to provide for transverse movement of said laser beam across said metal sheet.

4. The method of claim 1, further comprising:

heating said metal sheet, in order to reduce an amount of laser power needed to ablate metal from said metal sheet.

5. The method of claim 1, further comprising:

mechanically stressing said metal sheet, in order to reduce an amount of laser power needed to ablate metal from said metal sheet.

6. The method of claim 1, further comprising:

cooling said metal sheet, in order to reduce an amount of laser power needed to ablate metal from said metal sheet.

7. An apparatus including a flexible circuit etching system, said flexible circuit etching system comprising:

a reel-to-reel tape system that linearly presents a metal tape;

a laser that generates a laser beam having a power sufficient to ablate metal from said metal tape; and

a mirror that controllably moves to direct said laser beam toward said metal tape such that said laser beam ablates portions of said metal tape and deposits circuit structures on a target structure.

8. The apparatus of claim 7, further comprising:

a control system, coupled to said reel-to-reel tape system, to said laser, and to said mirror, that controls said reel-to-reel tape system, said laser, and said mirror,

wherein said control system controls said reel-to-reel tape system and said mirror to coordinate appropriate placement of said metal tape in accordance with control of said laser.

9. An apparatus including a laser ablation machine for patterning metal onto a target, said laser ablation machine comprising:

a laser; and

a patterning control system that positions said laser in relation to a metal sheet,

wherein said laser generates a laser beam having a power sufficient to ablate metal from metal sheet, and wherein said laser beam ablates portions of said metal sheet, and deposits circuit structures on a target structure.

10. The apparatus of claim 9, further comprising:

a control system, coupled to said laser and to said patterning control system, that controls said laser and said patterning control system,

wherein said control system controls said patterning control system to coordinate appropriate placement of said laser in relation to said metal sheet in accordance with control of said laser.

11. An apparatus including an electrical circuit, said electrical circuit produced by a method comprising the steps of:

providing a metal sheet;

providing a target structure; and

controlling a laser to generate a laser beam toward said metal sheet such that said laser beam ablates portions of said metal sheet and deposits said portions having been ablated to form said electrical circuit on said target structure.

12. The apparatus of claim 11, wherein said electrical circuit comprises an antenna for a radio frequency identification (RFID) tag.

13. The apparatus of claim 11, wherein said electrical circuit comprises a thermal circuit.