METHOD OF FABRICATING MICROELECTROMECHANICAL SYSTEMS DEVICES

• US 20090061562A1
• Filed: 11/11/2008
• Published: 03/05/2009
• Est. Priority Date: 05/24/2000
• Status: Active Grant

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Granted Patent: US 8,070,969 B2
• Time in Patent Office: Days
• US Class Current: 438/110
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation

Abstract

A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices.

Claims

1. A method of fabricating microelectromechanical systems devices, the method comprising the steps of:

providing a silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof,

applying a guard layer defining a plurality of recesses to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses;

segmenting the silicon substrate into discrete parts;

bonding an adhesive layer to a second surface of the silicon substrate, the second surface being opposite said first surface and the adhesive layer being curable in the presence of light;

segmenting the guard layer into discrete parts corresponding to the discrete parts of the silicon substrate thereby forming individual microelectromechanical systems devices; and

selectively exposing the adhesive layer to a light source allowing removal of individual microelectromechanical systems devices.

2. A method as claimed in claim 1, wherein at least one of said segmenting steps comprises etching.

3. A method as claimed in claim 1, wherein said light source is an ultraviolet light source.

4. A method as claimed in claim 1, wherein said light source exposes said adhesive layer through a mask.

5. A method as claimed in claim 1, further comprising the step of applying a handling layer to the adhesive layer so that the adhesive layer is located between the handling layer and the substrate, said handling layer being at least partially transparent.

6. A method as claimed in claim 1, wherein said microelectromechanical systems devices are printheads and said microelectromechanical systems elements are ink ejection nozzles, said method comprising the further step of etching a plurality of ink supply channels in the second surface of the silicon substrate prior to bonding the adhesive layer to the second surface.

7. A method as claimed in claim 6, comprising the further step of etching a plurality of ink ejection channels in the guard layer so that each ink ejection channel is in register with respective ink ejection nozzles.