Antenna arrangement

• US 20090061796A1
• Filed: 08/27/2007
• Published: 03/05/2009
• Est. Priority Date: 08/27/2007
• Status: Active Grant

• Current Assignee: Nokia Technologies Oy (Nokia Corporation)
• Original Assignee: Nokia Corporation
• Inventors: Hallivuori, Juha, Arkko, Aimo
• Granted Patent: US 8,121,539 B2
• Time in Patent Office: Days
• US Class Current: 455/121
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles

Abstract

A multi-part, distributed antenna arrangement including: an antenna element as a first part; and a semiconductor chip as a second part, separated from the first part, wherein the semiconductor chip comprises integrated radio frequency circuitry and a coupling element for wirelessly coupling the integrated radio frequency circuitry with the antenna element.

Claims

1. A multi-part, distributed antenna arrangement comprising:

an antenna element as a first part; and

a semiconductor chip as a second part, galvanically separated from the first part,

wherein the semiconductor chip comprises integrated radio frequency circuitry and a wireless coupling element for wirelessly coupling the integrated radio frequency circuitry with the antenna element.

2. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the wireless coupling element provides for a parasitic feed between the integrated radio frequency circuit and the antenna element.

3. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the arrangement is operable at a first frequency band when the antenna element is present and is inoperable at the first frequency band if the antenna element is removed.

4. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the integrated radio frequency circuitry includes amplification circuitry.

5. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the arrangement is operable at a first frequency band and wherein the wireless coupling element is a node connected to a conductor that is dimensioned and positioned to wirelessly couple with the antenna element at a first frequency band.

6. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the arrangement is operable at a first frequency band and wherein the wireless coupling element is a conductor that is dimensioned and positioned to wirelessly couple with the antenna element at a first frequency band.

7. A multi-part, distributed antenna arrangement as claimed in claim 6, wherein the conductor is integrated with the semiconductor chip.

8. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the integrated radio frequency circuitry comprises first amplification circuitry and second amplification circuitry and the semiconductor chip comprises a first wireless coupling element, adjacent a first portion of the antenna element, for wirelessly coupling the first amplification circuitry with the antenna element and a second wireless coupling element, adjacent a second portion of the antenna element, for wirelessly coupling the second amplification circuitry with the antenna element.

9. A multi-part, distributed antenna arrangement as claimed in claim 8, wherein the first amplification circuitry is for reception and the second amplification circuitry is for transmission.

10. A multi-part, distributed antenna arrangement as claimed in claim 8, wherein the first amplification circuitry is for reception and the second amplification circuitry is for diversity reception.

11. A multi-part, distributed antenna arrangement as claimed in claim 8, wherein the first amplification circuitry is for reception at a first frequency band and the second amplification circuitry is for simultaneous reception at a second different frequency band.

12. A multi-part, distributed antenna arrangement as claimed in claim 8, wherein the antenna element has a slot between the first portion and the second portion.

13. A multi-part, distributed antenna arrangement as claimed in claim 1, wherein the semiconductor chip is a silicon on insulator chip.

14. A radio communications apparatus comprising the multi-part, distributed antenna arrangement as claimed in claim 1.

15. A radio communications apparatus as claimed in claim 14, comprising an exterior housing defining a cavity that houses the semiconductor chip, wherein the exterior housing carries the antenna element at a position adjacent the semiconductor chip.

16. A radio communications apparatus as claimed in claim 14, comprising an exterior housing defining a cavity that houses the semiconductor chip, wherein the exterior housing is the antenna element at a position adjacent the semiconductor chip.

17. A semiconductor chip comprising:

integrated radio frequency circuitry and a wireless coupling element configured to wirelessly couple the integrated radio frequency circuitry with an off-chip antenna element.

18. A semiconductor chip as claimed in claim 17, wherein the integrated radio frequency circuitry includes amplification circuitry.

19. A semiconductor chip as claimed in claim 17, wherein the wireless coupling element comprises a conductor that is dimensioned and positioned to wirelessly couple with the antenna element at a first frequency band.

20. A semiconductor chip as claimed in claim 17, wherein the conductor is integrated within the semiconductor chip.

21. A semiconductor chip as claimed in claim 17, wherein the integrated radio frequency circuitry comprises first amplification circuitry and second amplification circuitry and the semiconductor chip comprises a first wireless coupling element, for positioning adjacent a first portion of the antenna element and a second wireless coupling element for positioning adjacent a second portion of the antenna element or a different antenna element.

22. A semiconductor chip as claimed in claim 21, wherein the first amplification circuitry is for reception and the second amplification circuitry is for transmission.

23. A semiconductor chip as claimed in claim 21, wherein the first amplification circuitry is for reception and the second amplification circuitry is for reception.

24. A semiconductor chip as claimed in claim 17, wherein the semiconductor chip is a silicon on insulator chip.

25. An antenna arrangement comprising:

a chip;

an off-chip antenna element;

on-chip radio frequency circuitry; and

an on-chip wireless coupling element for wirelessly coupling the on-chip radio frequency circuitry with the off-chip antenna element.

26. A method of manufacturing a radio communications apparatus comprising locating an antenna element adjacent a semiconductor chip, wherein the semiconductor chip comprises radio frequency circuitry and a coupling element for wirelessly coupling the radio frequency circuitry with the antenna element.

27. A method of manufacturing a radio communications apparatus as claimed in claim 26, wherein the antenna element is integrated with a housing of the radio communications apparatus and the antenna element is located by assembling the housing.

28. A multi-part, distributed antenna arrangement comprising:

an antenna element as a first part; and

a semiconductor chip as a second part, separated from the first part,

wherein the semiconductor chip comprises integrated radio frequency circuitry and a wireless coupling element for wirelessly coupling the integrated radio frequency circuitry with the antenna element.

29. A multi-part, distributed antenna arrangement comprising:

an antenna element as a first part; and

a semiconductor chip as a second part, galvanically separated from the first part, wherein the semiconductor chip comprises integrated radio frequency circuitry and wireless means for wirelessly coupling the integrated radio frequency circuitry with the antenna element.