Switchcable microneedle arrays and systems and methods relating to same

• US 20090062752A1
• Filed: 10/18/2007
• Published: 03/05/2009
• Est. Priority Date: 09/28/2001
• Status: Abandoned Application

• Current Assignee: Valeritas, LLC
• Original Assignee: Valeritas, LLC
• Inventors: Gonnelli, Robert R.
• Application Number:
  US11/975,353
• Publication Number:
  US 20090062752A1
• Time in Patent Office: Days
• US Class Current: 604/272
• CPC Class Codes: A61M 2037/003 having a lumen
• CPC Class Codes: A61M 2037/0053 Methods for producing microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles
• CPC Class Codes: A61M 5/1723 using feedback of body parameters, e.g. blood-sugar, pressure measurement of body parameters A61B5/00

Abstract

The microneedle devices disclosed herein in some embodiments include a substrate; one or more microneedles; and, optionally, a reservoir for delivery of drugs or collection of analyte, as well as pump(s), sensor(s), and/or microprocessor(s) to control the interaction of the foregoing. A switch or switching matrix may be connected to the microneedles to provide a switching mechanism for opening and closing a circuit coupled to the microneedle. A switch or switching matrix may be connected to the microneedle to provide a switching mechanisms for opening and closing a circuit coupled to the microneedle.

Claims

1. A microneedle device, comprising

a first layer formed into the shape of a microneedle and comprising a material suitable for piercing tissue, and

a second layer having a switch formed thereon and capable of being coupled into electrical communication with microneedle.

2. A microneedle device according to claim 1, further comprising

a second layer disposed above the first layer, and capable of acting as an electrical insulator.

3. A microneedle device according to claim 2, further comprising

a third layer disposed above the second layer and capable of conducting and electrical charge.

4. A microneedle according to claim 1, wherein the first layer comprises a metal.

5. A microneedle according to claim 4, wherein the metal material selected from copper, silver, tungsten, titanium, gold, platinum, palladium and nickel.

6. A microneedle according to claim 1, wherein the second layer comprises an electrically insulating material.

7. A microneedle according to claim 6, wherein the insulating material is selected from silicon, glass, plastic, air ceramic, oxidized silicon and mylar.

8. A microneedle according to claim 1, wherein the third layer comprises a metal.

9. A microneedle according to claim 6, wherein the metal is selected from copper, silver, tungsten, titanium, gold, platinum, palladium and nickel.

10. A microneedle according to claim 1, further comprising

a layer having an electron transfer agent.

11. A microneedle according to claim 1, wherein the electron transfer agent comprises an enzyme.

12. A microneedle according to claim 1, further comprising an ion-selective membrane disposed on the microneedle assembly.

13. A microneedle device according to claim 1, wherein the switch comprises a semiconductor switch.

14. A microneedle device according to claim 1, wherein the switch comprises a mechanical switch.

15. A microneedle device according to claim 1, wherein the switch comprises a micro-eletromechanical switch.

16. A microneedle device according to claim 1, wherein the switch comprises an array of switches.

17. A microneedle device according to claim 1, wherein the first layer includes a plurality of microneedles.

18. A microneedle device according to claim 17, wherein the second layer includes a plurality of switches in electrical communication with respective ones of said plural microneedles.

19. A microneedle device according to claim 17, wherein a first portion of the microneedles has a coating of a first catalyst material, and a second portion has a second catalyst material.

20. A patch comprising

a substrate,

a plurality of microneedles formed on the substrate, and

a switching matrix coupled to respective ones of the microneedles for selectively connecting a microneedle into an electrical circuit.

21. A process for manufacturing a microneedle, comprising

forming a first layer of material into an array of microneedles, and coupling the array to a switching matrix for selectively connecting a microneedle into an electrical circuit.