Semiconductor Device, Manufacturing Method Thereof, and Manufacturing Method of Antenna
First Claim
1. A manufacturing method of a semiconductor device comprising:
- forming an element group having a transistor over a substrate; and
pushing out a paste including conductive particles from a first opening of a screen printing plate to form a first conductive film over the element group,subsequently pushing out the paste including the conductive particles from a second opening of the screen printing plate to form a second conductive film functioning as an antenna,wherein the first conductive film is formed to be electrically insulated from the transistor; and
wherein the second conductive film is formed to be electrically connected to the transistor.
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Accused Products
Abstract
An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles from a first opening portion, and then a conductive film functioning as an antenna is formed continuously thereafter so as to electrically connect with the transistor, by pushing out a paste including conductive particles from a second opening portion. Therefore, an element group having a transistor, provided over a substrate; a first conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor; a second conductive film to be a dummy pattern provided to be adjacent to the first conductive film and is not electrically connected to the transistor; are included.
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Citations
24 Claims
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1. A manufacturing method of a semiconductor device comprising:
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forming an element group having a transistor over a substrate; and pushing out a paste including conductive particles from a first opening of a screen printing plate to form a first conductive film over the element group, subsequently pushing out the paste including the conductive particles from a second opening of the screen printing plate to form a second conductive film functioning as an antenna, wherein the first conductive film is formed to be electrically insulated from the transistor; and wherein the second conductive film is formed to be electrically connected to the transistor. - View Dependent Claims (5, 6, 7, 8, 20)
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2. A manufacturing method of a semiconductor device comprising:
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forming an element group having a transistor over a first substrate; and pushing out a paste including conductive particles from a first opening of a screen printing plate to form a first conductive film over a second substrate, subsequently pushing out the paste including the conductive particles from a second opening of the screen printing plate to form a second conductive film functioning as an antenna, wherein the first conductive film is formed to be electrically insulated from the transistor; and wherein the second conductive film formed over the second substrate is electrically connected to the transistor.
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3. A manufacturing method of a semiconductor device comprising:
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forming an element group having a transistor over a first substrate; and pushing out a paste including conductive particles from a first opening of a screen printing plate to form over a second substrate a first conductive film, subsequently pushing out the paste including the conductive particles from a second opening portion of the screen printing plate to form a second conductive film functioning as an antenna, wherein the first conductive film is formed to be electrically insulated from the transistor; and wherein the first substrate and the second substrate are stuck together so that the transistor and the second conductive film functioning as an antenna are electrically connected. - View Dependent Claims (4)
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9. A semiconductor device comprising:
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an element group having a transistor, provided over a substrate; a first conductive film formed over the element group and electrically insulated from the transistor; and a second conductive film functioning as an antenna provided adjacent to the first conductive film and provided to be electrically connected to the transistor.
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10. A semiconductor device comprising:
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an element group having a transistor, provided over a substrate; a first conductive film provided over the element group and electrically insulated from the transistor; and a second conductive film functioning as an antenna provided adjacent to the first conductive film and provided to be electrically connected to the transistor, wherein the second conductive film is in a coil form; wherein the first conductive film is bent and has a first end portion and a second end portion; and wherein the first end portion and the second end portion are not connected. - View Dependent Claims (11, 12, 13, 21, 22, 23, 24)
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14. A semiconductor device comprising:
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an element group having a transistor, provided over a substrate; and a coil-formed conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor, wherein a width of a portion of the conductive film positioned in an outermost circumference is wider than a width of a portion positioned on an inner side.
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15. A manufacturing method of an antenna comprising
pushing out a paste including conductive particles from a first opening of a screen printing plate to form over a substrate a first conductive film, subsequently pushing out the paste including the conductive particles from a second opening of the screen printing plate to form a second conductive film functioning as an antenna.
Specification