LED chip package structure with high-efficiency light-emitting effect and method of packing the same

• US 20090065789A1
• Filed: 09/12/2007
• Published: 03/12/2009
• Est. Priority Date: 09/12/2007
• Status: Active Grant

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Chuang, Jonnie, Wu, Wen-Kuei
• Granted Patent: US 7,834,365 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

Claims

1. A method of packaging LED chips package structure with high-efficiency light-emitting effect, comprising:

providing a substrate unit, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body;

arranging a plurality of LED chips on the substrate body via a matrix method to form a plurality of longitudinal LED chip rows, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; and

longitudinally and respectively covering a plurality of stripped package colloids on the longitudinal LED chip rows via a first mold unit, wherein each stripped package colloid has a plurality of colloid cambered surfaces that form on a top surface thereof and correspond to the LED chips.

2. The method as claimed in claim 1, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

3. The method as claimed in claim 1, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

4. The method as claimed in claim 1, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

5. The method as claimed in claim 1, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

6. The method as claimed in claim 1, wherein each longitudinal LED chip row is straightly arranged on the substrate body of the substrate unit.

7. The method as claimed in claim 1, wherein each stripped package colloid has a plurality colloid lateral surfaces respectively formed in front of the corresponding colloid cambered surfaces.

8. The method as claimed in claim 7, wherein the first mold unit is composed of a first upper mold and a first lower mold for supporting the substrate body, and the first upper mold has a plurality of first channels corresponding to the longitudinal LED chip rows;

wherein each first channel has a plurality of concave grooves, each concave groove has a mold cambered surface and a mold lateral surface respectively formed on a top surface and a front surface thereof, and the mold cambered surface corresponds to the corresponding colloid cambered surface and the mold lateral surface corresponds to the corresponding colloid lateral surface;

wherein each first channel has a size is same as that of each stripped package colloid.

9. The method as claimed in claim 1, wherein each stripped package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

10. The method as claimed in claim 1, wherein each stripped package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

11. The method as claimed in claim 1, further comprising:

transversely cutting the stripped package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covered on the corresponding LED chips, wherein a top surface of each package colloid is the colloid cambered surface and each package colloid has a colloid light-emitting surface formed in front of the corresponding colloid cambered surface;

respectively covering and filling a frame unit on the substrate body, on the package colloids, and between each two adjacent package colloids via a second mold unit; and

transversely cutting the frame unit and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a frame layer for exposing the colloid light-emitting surfaces of the package colloids.

12. The method as claimed in claim 11, wherein the second mold unit is composed of a second upper mold and a second lower mold for supporting the substrate body, the second upper mold has a second channel corresponding to the frame unit, and the second channel has a height the same as that of each package colloid and the second channel has a width the same as that of the frame unit.

13. The method as claimed in claim 11, wherein the frame layer is an opaque frame layer.

14. The method as claimed in claim 13, wherein the opaque frame layer is a white frame layer.

15. The method as claimed in claim 1, further comprising:

transversely cutting the stripped package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covered on the corresponding LED chips, wherein a top surface of each package colloid is the colloid cambered surface and each package colloid has a colloid light-emitting surface formed in front of the corresponding colloid cambered surface;

respectively covering and filling a plurality of stripped frame layers on the substrate body, on the package colloids, and between each two longitudinal and adjacent package colloids via a third mold unit; and

transversely cutting the stripped frame layers and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a plurality of frame bodies for respectively exposing the colloid light-emitting surfaces of the package colloids.

16. The method as claimed in claim 15, wherein the third mold unit is composed of a third upper mold and a third lower mold for supporting the substrate body, the third upper mold has a plurality of third channels corresponding to the longitudinal LED chip rows, and each third channel has a height the same as that of each corresponding package colloid and each third channel has a width larger than that of each corresponding package colloid.

17. The method as claimed in claim 15, wherein each frame body is an opaque frame body.

18. The method as claimed in claim 17, wherein the opaque frame body is a white frame body.

19. The method as claimed in claim 1, wherein the first mold unit is composed of a first upper mold and a first lower mold for supporting the substrate body, the first upper mold has a plurality of first channels corresponding to the longitudinal LED chip rows;

wherein each first channel has a mold cambered surface and a mold lateral surface respectively formed on a top surface and a front surface thereof, and each first channel has a height and a width the same as those of each stripped package colloid.

20. The method as claimed in claim 19, further comprising:

longitudinally cutting the stripped package colloids along a line between each two adjacent and transverse LED chips to form a plurality of package colloids that are separated from each other and respectively covered on the corresponding LED chips, wherein each package colloid has a colloid cambered surface formed on a top surface thereof and a colloid light-emitting surface formed in front of the corresponding colloid cambered surface;

respectively covering and filling a frame unit on the substrate body, on the package colloids, and between each two adjacent package colloids via a second mold unit; and

transversely cutting the frame unit and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a frame layer for exposing the colloid light-emitting surfaces of the package colloids.

21. The method as claimed in claim 20, wherein the second mold unit is composed of a second upper mold and a second lower mold for supporting the substrate body, the second upper mold has a second channel corresponding to the frame unit, and the second channel has a height the same as that of each package colloid and the second channel has a width the same as that of the frame unit.

22. The method as claimed in claim 19, further comprising:

longitudinally cutting the stripped package colloids along a line between each two adjacent and transverse LED chips to form a plurality of package colloids that are separated from each other and respectively covered on the corresponding LED chips, wherein each package colloid has a colloid cambered surface formed on a top surface thereof and a colloid light-emitting surface formed in front of the corresponding colloid cambered surface;

respectively covering and filling a plurality of stripped frame layers on the substrate body, on the package colloids, and between each two longitudinal and adjacent package colloids via a third mold unit; and

transversely cutting the stripped frame layers and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a plurality of frame bodies for respectively exposing the colloid light-emitting surfaces of the package colloids.

23. The method as claimed in claim 22, wherein the third mold unit is composed of a third upper mold and a third lower mold for supporting the substrate body, the third upper mold has a plurality of third channels corresponding to the longitudinal LED chip rows, and each third channel has a height the same as that of each corresponding package colloid and each third channel has a width larger than that of each corresponding package colloid.

24. An LED chip package structure with high-efficiency light-emitting effect, comprising:

a substrate unit having a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body;

a light-emitting unit having a plurality of LED chips arranged on the substrate body, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; and

a package colloid unit having a plurality of package colloids respectively covered on the LED chips, wherein each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

25. The LED chip package structure as claimed in claim 24, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

26. The LED chip package structure as claimed in claim 24, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

27. The LED chip package structure as claimed in claim 24, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

28. The LED chip package structure as claimed in claim 24, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

29. The LED chip package structure as claimed in claim 24, wherein each longitudinal LED chip row is straightly arranged on the substrate body of the substrate unit.

30. The LED chip package structure as claimed in claim 24, wherein the LED chips are straightly arranged on the substrate body of the substrate unit along a plurality of straight lines.

31. The LED chip package structure as claimed in claim 24, wherein each stripped package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

32. The LED chip package structure as claimed in claim 24, wherein each stripped package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

33. The LED chip package structure as claimed in claim 24, further comprising a frame unit that is a frame layer covered on the substrate body and disposed around whole lateral sides of each package colloid for exposing the colloid light-emitting surfaces of the package colloids.

34. The LED chip package structure as claimed in claim 33, wherein the frame layer is an opaque frame layer.

35. The LED chip package structure as claimed in claim 34, wherein the opaque frame layer is a white frame layer.

36. The LED chip package structure as claimed in claim 24, further comprising a frame unit has a plurality of frame bodies, wherein each frame body is covered on the package colloid for exposing the light-emitting surface of each corresponding package colloid, and the frame bodies are separated from each other.

37. The LED chip package structure as claimed in claim 36, wherein each frame body is an opaque frame body.

38. The LED chip package structure as claimed in claim 37, wherein the opaque frame body is a white frame body.