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WHITE LIGHT LED WITH MULTIPLE ENCAPSULATION LAYERS

  • US 20090065791A1
  • Filed: 09/06/2007
  • Published: 03/12/2009
  • Est. Priority Date: 09/06/2007
  • Status: Active Grant
First Claim
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1. A packaged light-emitting semiconductor device, comprising:

  • a housing having a recessed volume;

    one or more light-emitting semiconductor dies disposed in the recessed volume;

    a first encapsulation material disposed above the one or more light-emitting semiconductor dies;

    a second encapsulation material disposed above the first encapsulation material such that only a portion of an upper surface of the first encapsulation material is covered by the second encapsulation material; and

    a third encapsulation material disposed above the first and second encapsulation materials.

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