ELECTROCHEMICALLY FABRICATED MICROPROBES

• US 20090066351A1
• Filed: 09/02/2008
• Published: 03/12/2009
• Est. Priority Date: 02/04/2003
• Status: Abandoned Application

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Arat, Vacit, Kim, Kieun, Kruglick, Ezekiel J. J., Chen, Richard T.
• Application Number:
  US12/203,102
• Publication Number:
  US 20090066351A1
• Time in Patent Office: Days
• US Class Current: 324/762.20
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

Claims

1. A probe device for testing integrated circuits, comprising:

a bridging element;

a plurality of contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a pad of an integrated circuit and wherein the arms are configured to scrub a surface of the pad as contact between the first end and the pad is made.

2. The probe of claim 1 wherein a relative movement between the bridging element of the probe device and the pad of the integrated circuit is substantially perpendicular to a plane of the pad.

3. The probe of claim 1 wherein the plurality of the contact arms have an outward taper.

4. The probe of claim 1 wherein the plurality of the contact arms have an inward taper.

5. The probe of claim 1 additionally wherein the second end of each arm comprises a compliant member.

6. The probe of claim 5 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element.

7. The probe of claim 1 additionally wherein the bridging element comprises a compliant member.

8. The probe of claim 7 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element.

9. The probe of claim 7 wherein the compliant member is located adjacent the plurality of arms.

10. The probe of claim 7 wherein the compliant member is located away from a location where the second end of the arms contact the bridging element.

11. The probe of claim 1 wherein the plurality of contact arms are formed from a plurality of adhered layers of deposited material.

12. The probe of claim 7 wherein the compliant member is formed from a plurality of adhered layers of material.

24. The probe device of claim 1 incorporated into an array of probe devices with a plurality of probe devices each comprising a conductive bridging element and a plurality of conductive arms where each of the plurality of probe devices is adhered to a substrate.

13. A probe device for testing integrated circuits, comprising:

a bridging element;

a plurality of contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a pad of an integrated circuit and wherein at least one of the arms or the bridging element is configured to provide compliance between the probe device and the pad as contact is made.

14. The probe of claim 13 wherein a relative movement between the bridging element of the probe device and the pad of the integrated circuit is substantially perpendicular to a plane of the pad.

15. The probe of claim 13 wherein the plurality of the contact arms have an outward taper.

16. The probe of claim 13 wherein the plurality of the contact arms have an inward taper.

17. The probe of claim 13 additionally wherein the second end of each arm comprises a compliant member.

18. The probe of claim 17 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element.

19. The probe of claim 13 additionally wherein the bridging element comprises a compliant member.

20. The probe of claim 19 wherein the compliant member provides compliance in a direction parallel to a direction of relative movement between the pad and the bridging element.

21. The probe of claim 19 wherein the compliant member is located adjacent the plurality of arms.

22. The probe of claim 19 wherein the compliant member is located away from a location where the second end of the arms contact the bridging element.

23. The probe of claim 13 wherein the plurality of contact arms are formed from a plurality of adhered layers of deposited material.

25. The probe device of claim 13 incorporated into an array of probe devices with a plurality of probe devices each comprising a conductive bridging element and a plurality of conductive arms where each of the plurality of probe devices is adhered to a substrate.