Reprogrammable three dimensional field programmable gate arrays
First Claim
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1. A system for organizing reprogrammable three dimensional (3D) field programmable gate arrays (FPGAs), comprising:
- a set of arrays of logic and memory components on two or more layers of a hybrid multilayer logic device;
a set of SRAM tiles on the outer edge of each layer;
a set of logic block arrays on tiles in the interior of each layer arranged in symmetrical rows connected by interconnects and TSVs;
a set of switch matrices on tiles in the interior of each layer to connect the logic block arrays and the memory components with interconnects and TSVs;
a set of look up tables (LUTs) on memory tiles for access to arithmetic data;
movable interconnects within the logic block arrays that change position when activated by at least one switch matrix from one ASIC position to another ASIC position; and
a set of TSVs that connect the tiles of one layer to the tiles of an adjacent layer.
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Abstract
3D FPGAs are elucidated with (a) interlayer information sharing, (b) intermittent and variable timing of layer configuration and (c) multilayer multi-functionality. 3D FPGAs are applied to reprogrammable SoCs.
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Citations
11 Claims
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1. A system for organizing reprogrammable three dimensional (3D) field programmable gate arrays (FPGAs), comprising:
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a set of arrays of logic and memory components on two or more layers of a hybrid multilayer logic device; a set of SRAM tiles on the outer edge of each layer; a set of logic block arrays on tiles in the interior of each layer arranged in symmetrical rows connected by interconnects and TSVs; a set of switch matrices on tiles in the interior of each layer to connect the logic block arrays and the memory components with interconnects and TSVs; a set of look up tables (LUTs) on memory tiles for access to arithmetic data; movable interconnects within the logic block arrays that change position when activated by at least one switch matrix from one ASIC position to another ASIC position; and a set of TSVs that connect the tiles of one layer to the tiles of an adjacent layer. - View Dependent Claims (2, 3, 4)
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5. A system for organizing one or more layers of reprogrammable three dimensional (3D) field programmable gate arrays (FPGAs) in a multi-layer integrated circuit, comprising:
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a set of arrays of logic and memory components on one or more layers of a hybrid multi-layer integrated circuit, each with a set of SRAM tiles, logic block array tiles and switch matrix tiles; and wherein the logic components of an FPGA layer store data and instructions in and access data and instructions from memory components on other layers of the multi-layer integrated circuit. - View Dependent Claims (6, 7, 8)
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9. A system for organizing one or more layers of reprogrammable three dimensional (3D) field programmable gate arrays (FPGAs) in a multi-layer integrated circuit, comprising:
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a set of arrays of logic and memory components on one or more layers of a hybrid multi-layer integrated circuit, each with a set of SRAM tiles, logic block array tiles and switch matrix tiles; wherein when the environment changes, a sensor is activated in the device application for each FPGA layer and the FPGA layer reconfigures the interconnects in the logic block arrays to a different ASIC layout structure; and wherein the multi-layer FPGA uses D-EDA modeling to design the customized placement and routing configuration of each change of phase state of the FPGA as it reprograms. - View Dependent Claims (10, 11)
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Specification