PLANAR INDUCTIVE STRUCTURE

• US 20090066461A1
• Filed: 05/21/2008
• Published: 03/12/2009
• Est. Priority Date: 05/23/2007
• Status: Active Grant

• Current Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SA (STMicroelectronics NV)
• Inventors: Ezzeddine, Hilal
• Granted Patent: US 8,203,416 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 5/10 for coupling balanced lines or devices with unbalanced lines or devices

Abstract

A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.

Claims

1. A spiral structure comprising at least one planar winding in at least one first conductive level to form at least one inductive element, wherein:

said winding is surrounded with a conductive plane; and

at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.

2. The structure of claim 1, wherein said conductive track is continuous from one end to the other.

3. The structure of claim 1, wherein said conductive track is interrupted at the center of the winding.

4. The structure of claim 1, wherein the width of the conductive track is, at the center of the winding, smaller than or equal to one third of the internal diameter of the winding.

5. The structure of claim 1, wherein said conductive plane is intended to be connected to a reference voltage.

6. The structure of claim 1, wherein several conductive tracks are distributed in the second conductive level by having their respective ends connected to the conductive plane of the first level.

7. The structure of claim 1, wherein at least one second winding is formed in a third conductive level superposed to the first two.

8. The structure of claim 1, wherein two interdigited planar windings are formed in the first level.

9. The structure of claim 1, wherein the width of the conductive track is greater at the center of the structure than at its ends intended to be connected to the conductive plane of the first level.

10. An inductive element comprising the structure of claim 1.

11. A combiner/divider in distributed lines comprising:

a first line formed of a first planar winding in a first conductive level and of a second planar winding in a third conductive level; and

a second line formed of a third planar winding interdigited with the first winding in the first level, and of a fourth planar winding interdigited with the second winding in the third level,

wherein a conductive track in accordance with the structure of claim 1 is formed in a second conductive level superposed to the other two.

12. The combiner/divider of claim 11, wherein the windings have a width increasing from the inside to the outside.