PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD
First Claim
1. A printed circuit board, comprising:
- a first pattern structure including a first ground pattern;
a second pattern structure formed on the first pattern structure, the second pattern structure including;
a first line pattern; and
a second ground pattern electrically insulated from the first line pattern;
a third pattern structure formed on the second pattern structure, the third pattern structure including;
a third ground pattern; and
a second line pattern electrically insulated from the third ground pattern; and
a fourth pattern structure formed on the third pattern structure, the fourth pattern structure including a fourth ground pattern,wherein the first line pattern is disposed between the first ground pattern and the third ground pattern, and the second line pattern is disposed between the second ground pattern and the fourth ground pattern.
2 Assignments
0 Petitions
Accused Products
Abstract
A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.
18 Citations
20 Claims
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1. A printed circuit board, comprising:
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a first pattern structure including a first ground pattern; a second pattern structure formed on the first pattern structure, the second pattern structure including; a first line pattern; and a second ground pattern electrically insulated from the first line pattern; a third pattern structure formed on the second pattern structure, the third pattern structure including; a third ground pattern; and a second line pattern electrically insulated from the third ground pattern; and a fourth pattern structure formed on the third pattern structure, the fourth pattern structure including a fourth ground pattern, wherein the first line pattern is disposed between the first ground pattern and the third ground pattern, and the second line pattern is disposed between the second ground pattern and the fourth ground pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A display apparatus, comprising:
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a display panel displaying an image; and a printed circuit board including; a first pattern structure including a first ground pattern; a second pattern structure formed on the first pattern structure, the second pattern structure including a first line pattern and a second ground pattern electrically insulated from the first line pattern; a third pattern structure formed on the second pattern structure, the third pattern structure including a third ground pattern and a second line pattern electrically insulated from the third ground pattern; and a fourth pattern structure formed on the third pattern structure, the fourth pattern structure including a fourth ground pattern, wherein the first line pattern is disposed between the first ground pattern and the third ground pattern, and the second line pattern is disposed between the second ground pattern and the fourth ground pattern. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of manufacturing a printed circuit board, the method comprising:
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forming a first pattern structure on a first surface of a first insulation substrate, the first pattern structure including a first ground pattern; forming a second pattern structure on a second surface of the first insulation substrate opposite to the first surface, the second pattern structure including a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern; disposing a second insulation substrate on the second pattern structure; forming a third pattern structure on the second insulation substrate, the third pattern structure including a second line pattern overlapping the second ground pattern and a third ground pattern electrically insulated from the second line pattern and overlapping the first line pattern; disposing a third insulation substrate on the third pattern structure; and forming a fourth pattern structure on the third insulation substrate, the fourth pattern structure including a fourth ground pattern overlapping the second line pattern. - View Dependent Claims (18, 19)
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20. A method of manufacturing a printed circuit board, the method comprising:
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forming a first pattern structure on a first surface of a first insulation substrate, the first pattern structure including a first ground pattern; forming a second pattern structure on a second surface of the first insulation substrate opposite to the first surface, the second pattern structure including a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern; forming a third pattern structure on a second insulation layer, the third pattern structure including a second line pattern and a third ground pattern; forming a fourth pattern structure on a fourth insulation substrate, the fourth pattern structure including a fourth ground pattern; disposing the second insulation substrate on the second pattern structure, so that the second line pattern and the third ground pattern respectively overlap the second ground pattern and the first line pattern, and the second insulation substrate is interposed between the second pattern structure and the third pattern structure; and disposing the third insulation substrate on the third pattern structure, so that the fourth ground pattern overlaps the second line pattern and the third insulation substrate is interposed between the third pattern structure and the fourth pattern structure.
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Specification