×

High Density In-Package Microelectronic Amplifier

  • US 20090067137A1
  • Filed: 09/05/2008
  • Published: 03/12/2009
  • Est. Priority Date: 09/07/2007
  • Status: Active Grant
First Claim
Patent Images

1. A sensor module comprising:

  • a package substrate,a sensor disposed within and electrically connected to the package substrate,an amplifier disposed within and electrically connected to the package substrate, andelectrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×