High Density In-Package Microelectronic Amplifier
First Claim
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1. A sensor module comprising:
- a package substrate,a sensor disposed within and electrically connected to the package substrate,an amplifier disposed within and electrically connected to the package substrate, andelectrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
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Abstract
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
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1 Claim
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1. A sensor module comprising:
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a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
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Specification