CIRCUIT PATTERN DESIGNING METHOD, WHEREIN AN ELECTROCONDUCTIVE COATING MATERIAL IS USED, AND A PRINTED CIRCUIT BOARD

• US 20090067145A1
• Filed: 06/02/2008
• Published: 03/12/2009
• Est. Priority Date: 06/08/2007
• Status: Abandoned Application

• Current Assignee: SMK Corporation
• Original Assignee: SMK Corporation
• Inventors: Kataoka, Yasutaka, Kasagi, Nobuo
• Application Number:
  US12/131,474
• Publication Number:
  US 20090067145A1
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/247 Finish coating of conductors by using conductive pastes, inks or powders
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

In a method of preparing a circuit pattern on a printed circuit board, reflow wiring is performed by printing the circuit pattern on an insulative board with an electroconductive coating material and printing a cream solder in a wiring pattern portion of the circuit pattern to form a metal conductor. Other portions of the printed, electroconductive coating material are arranged to function as any one of a resistor (R), a capacitor (C), and a coil (L), by taking advantage of the resistance and electrostatic capacitance of the electroconductive coating material.

Claims

1. A method of designing a printed circuit board, wherein a circuit pattern of the printed circuit board is designed, comprising the step of:

reflow wiring by printing a circuit pattern on an insulative board with an electroconductive coating material and printing a cream solder in a wiring pattern portion of the circuit pattern to form a metal conductor.

2. A method of designing a printed circuit board, wherein a circuit pattern of the printed circuit board is designed, comprising the step of:

printing an electroconductive coating material on an insulative board so that it functions as any one of a resistor (R), a capacitor (C), or an inductor (L), according to one of a resistance inductance of electrostatic capacitance of the electroconductive coating material, respectively.

3. A printed circuit board having a circuit pattern, wherein

reflow wiring is performed by printing the circuit pattern on an insulative board with an electroconductive coating material and printing a cream solder in a wiring pattern portion of the circuit pattern that is needed as a metal conductor.

4. A printed circuit board having a circuit pattern or an inductor, wherein

the circuit pattern is printed on an insulative board with an electroconductive coating material;

and

at least one of a resistor (R), a capacitor (C), or an inductor a coil (L) is printed in the circuit pattern.

5. The printed circuit board of claim 4, wherein the printed circuit pattern includes at least two components selected from the group consisting of resistors (R), inductors (L) and capacitors (C), the at least two components being connected to one or more metal conductors (a) each comprising a portion of the printed circuit pattern and cream solder printed on the portion of the printed circuit pattern.

6. The printed circuit board of claim 4, wherein the at least two components comprise a resistor (R) and a capacitor (C).