POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL
First Claim
1. A positive photoresist composition used to form a thick film resist pattern on a support, comprising:
- (A) a compound that generates acid on irradiation with active light or radiation and (B) a resin that displays increased alkali solubility under the action of acid, whereinsaid component (B) comprises a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by a general formula (I) shown below;
[wherein, Y represents an aliphatic cyclic group or an alkyl group which may comprise a substituent group;
n represents either 0 or an integer from 1 to 3;
R1 and R2 each independently represents a hydrogen atom or a lower alkyl group of 1 to 5 carbon atoms].
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Abstract
The present invention provides a positive photoresist composition used to form a thick film resist pattern on a support which includes (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by represented by a general formula (I) shown below:
[wherein, Y represents an aliphatic cyclic group or an alkyl group which may have a substituent group; n represents either 0 or an integer from 1 to 3; R1 and R2 each independently represents a hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms].
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Citations
7 Claims
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1. A positive photoresist composition used to form a thick film resist pattern on a support, comprising:
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(A) a compound that generates acid on irradiation with active light or radiation and (B) a resin that displays increased alkali solubility under the action of acid, wherein said component (B) comprises a resin (B1) which has a structural unit (b1) derived from an acrylate ester, in which a hydrogen atom of a carboxyl group has been substituted with an acid dissociable, dissolution inhibiting group represented by a general formula (I) shown below; [wherein, Y represents an aliphatic cyclic group or an alkyl group which may comprise a substituent group;
n represents either 0 or an integer from 1 to 3;
R1 and R2 each independently represents a hydrogen atom or a lower alkyl group of 1 to 5 carbon atoms].- View Dependent Claims (2, 3, 4, 5, 6, 7)
[wherein, Y represents an aliphatic cyclic group which may comprise a substituent group or an alkyl group;
n represents either 0 or an integer from 1 to 3;
m represents 0 or 1;
R each represents, independently, a hydrogen atom, a lower alkyl group of 1 to 5 carbon atoms, a fluorine atom or a fluorinated lower alkyl group of 1 to 5 carbon atoms;
R1 and R2 each represents, independently, a hydrogen atom or an lower alkyl group of 1 to 5 carbon atoms].
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3. The positive photoresist composition according to claim 1, further comprising an alkali-soluble resin (C).
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4. The positive photoresist composition according to claim 1, further comprising an acid diffusion control agent (D).
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5. A thick film photoresist laminate, wherein a support and a thick film photoresist layer with a film thickness of 10 to 150 μ
- m comprising the positive photoresist composition according to claim 1 is laminated.
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6. A method for producing a thick film resist pattern comprising:
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laminating for producing the thick film photoresist laminate according to claim 5, exposing for selectively irradiating the thick film photoresist laminate with active light or radiation, and developing for producing a thick film resist pattern following the exposure.
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7. A method for producing a connecting terminal comprising:
forming a connection terminal formed from a conductor on a resist-free portion of a thick film resist pattern produced using the method for producing a thick film resist pattern according to claim 6.
Specification