Method of Forming a Micromagnetic Device
First Claim
1. A method of forming a micromagnetic device on a substrate, comprising:
- forming a first insulating layer above said substrate;
forming a first seed layer above said first insulating layer;
forming a first conductive winding layer above said first seed layer;
forming a second insulating layer above said first conductive winding layer;
forming a first magnetic core layer above said second insulating layer;
forming a third insulating layer above said first magnetic core layer;
forming a second magnetic core layer above said third insulating layer;
forming a fourth insulating layer above said second magnetic core layer;
forming a second seed layer above said fourth insulating layer; and
forming a second conductive winding layer above said second seed layer and in vias to said first conductive winding layer, said first conductive winding layer and said second conductive winding layer forming a winding for said micromagnetic device.
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Abstract
A method of forming a micromagnetic device on a substrate including forming a first insulating layer above the substrate, a first seed layer above the first insulating layer, a first conductive winding layer above the first seed layer, and a second insulating layer above the first conductive winding layer. The method also includes forming a first magnetic core layer above the second insulating layer, a third insulating layer above the first magnetic core layer, and a second magnetic core layer above the third insulating layer. The method still further includes forming a fourth insulating layer above the second magnetic core layer, a second seed layer above the fourth insulating layer, and a second conductive winding layer above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.
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Citations
30 Claims
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1. A method of forming a micromagnetic device on a substrate, comprising:
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forming a first insulating layer above said substrate; forming a first seed layer above said first insulating layer; forming a first conductive winding layer above said first seed layer; forming a second insulating layer above said first conductive winding layer; forming a first magnetic core layer above said second insulating layer; forming a third insulating layer above said first magnetic core layer; forming a second magnetic core layer above said third insulating layer; forming a fourth insulating layer above said second magnetic core layer; forming a second seed layer above said fourth insulating layer; and forming a second conductive winding layer above said second seed layer and in vias to said first conductive winding layer, said first conductive winding layer and said second conductive winding layer forming a winding for said micromagnetic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of forming a micromagnetic device on a substrate, comprising:
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forming a first seed layer above said substrate; forming a first conductive winding layer above said first seed layer; forming a first insulating layer above said first conductive winding layer; forming a second seed layer above said first insulating layer; forming a first magnetic core layer above said second seed layer; forming a first protective layer above said first magnetic core layer; forming a second insulating layer above said first protective layer; forming a third seed layer above said second insulating layer; forming a second magnetic core layer above said third seed layer; forming a second protective layer above said second magnetic core layer; forming a third insulating layer above said second magnetic core layer; and forming a second conductive winding layer above said third insulating layer and in vias to said first conductive winding layer, said first conductive winding layer and said second conductive winding layer forming a winding for said micromagnetic device. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification