Production methods of electronic devices

• US 20090068795A1
• Filed: 10/24/2008
• Published: 03/12/2009
• Est. Priority Date: 12/27/2002
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Higashi, Mitsutoshi
• Granted Patent: US 8,216,884 B2
• Time in Patent Office: Days
• US Class Current: 438/121
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A method of producing an electronic device having mounted thereon a microelectromechanical system element. The method includes forming a micromachine component and electronic component for operation of the micromachine component on a substrate to form the system element, and bonding to the substrate a lid covering an active surface of the substrate and provided with wiring patterns to define an operating space for the micromachine component and electrically connecting the electronic component and the wiring patterns of the lid at a bonded part of the substrate and the lid.

Claims

1. A method of production of an electronic device having mounted thereon a microelectromechanical system element, which comprises the steps of:

forming a micromachine component and electronic component for operation of said micromachine component on a substrate to form said system element; and

bonding to said substrate a lid covering an active surface of said substrate and provided with wiring patterns to define an operating space for said micromachine component and electrically connecting said electronic component and the wiring patterns of said lid at a bonded part of said substrate and said lid.

2. A method of production of an electronic device as set forth in claim 1, in which said bonded part is formed by ultrasonic bonding of said substrate and said lid.

3. A method of production of an electronic device as set forth in claim 1 or 2, which further comprises a step of forming at said substrate and/or said lid a cavity at an operating spaceside thereof.

4. A method of production of an electronic device as set forth in claim 1 or 2, which further comprises a step of arranging between said substrate and a lid having no wiring pattern an intermediate member provided with an opening for operation of said micromachine component and wiring patterns, and electrically connecting said electronic component and the wiring patterns of said intermediate member.

5. A method of production of an electronic device as set forth in claim 2, which further comprises a step of forming, at said substrate, said lid, and an intermediate member arranged in accordance with need between said substrate and said lid, a second continuous ultrasonic bonded part in contact with at an outer periphery of said operating space side of said substrate and other members without interruption.

6. A method of production of an electronic device as set forth in claim 1 or 2, which further comprises a step of applying a sealing resin to the outside of said bonded part to surround and bond the same.

7. A method of production of an electronic device as set forth in claim 1 or 2, which further comprising batch-wise producing a plurality of said electronic devices at the same time by a wafer level package process, then cutting out the individual electronic devices.

8. A method of production of an electronic device having mounted thereon a functional element, which comprising the steps of:

securing said functional element to a device body and/or lid; and

bonding said device body and said lid to define an element-carrying space, forming a continuous ultrasonic bonded part at said device body and said lid in contact with an outer periphery of said element-carrying space side of said members without interruption, and thereby sealing air-tightly said element-carrying space.

9. A method of production of an electronic device as set forth in claim 8, which further comprises a step of arranging between said device body and said lid an intermediate member provided with an opening and wiring patterns.

10. A method of production of an electronic device as set forth in claim 8 or 9, which further comprises a step of forming an ultrasonic bonded part for use in electrical connection between said functional element and an outernal element and others, in addition to the step of forming said ultrasonic bonded part for air-tight sealing.

11. A method of production of an electronic device as set forth in claim 8 or 9, which further comprises a step of applying a sealing resin to the outside of said ultrasonic bonded part for air-tight sealing to surround and bond the same.

12. A method of covering and securing a lid in an electronic device having mounted thereon a functional element, which comprises a step of forming securing regions in predetermined patterns at an outer periphery of a device body carrying said functional element, bringing corresponding parts of said lid into abutment with said securing regions, and sealing air-tight said device body and said lid by ultrasonic bonding.

13. A method of securing a lid in an electronic device as set forth in claim 12, which further comprises a step of arranging between said device body and said lid an intermediate member provided with an opening and ultrasonically bonding said intermediate member, said device body and said lid.

14. A method of securing a lid in an electronic device as set forth in claim 12 or 13, which further comprises a step of applying a sealing resin to an outside surface of the formed ultrasonic bonded part to surround and bond the same.