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Three dimensional integrated circuits and methods of fabrication

  • US 20090070727A1
  • Filed: 09/12/2008
  • Published: 03/12/2009
  • Est. Priority Date: 09/12/2007
  • Status: Active Grant
First Claim
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1. A system for organizing semiconductor integrated circuits (ICs) into a set of layers of circuits with through silicon vias (TSVs), comprising:

  • Combining several layers of ICs in a multi-layer module;

    Positioning TSVs connecting adjacent layers;

    Connecting three or more layers with contiguous TSVs;

    Wherein electronic signals are transmitted through the TSVs from one layer of the multilayer module to other layers; and

    Wherein the multilayer IC performs specific computational tasks.

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