3D INTEGRATED COMPASS PACKAGE

• US 20090072823A1
• Filed: 09/17/2007
• Published: 03/19/2009
• Est. Priority Date: 09/17/2007
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Bohlinger, Michael J., Rieger, Ryan W., Wan, Hong
• Application Number:
  US11/856,619
• Publication Number:
  US 20090072823A1
• Time in Patent Office: Days
• US Class Current: 324/247
• CPC Class Codes: G01R 33/0206 Three-component magnetometers

Abstract

A 3-axis sensor package with on-board sensor support chip on a single chip. In one aspect of the invention, a sensor package includes an X-axis sensor circuit component, a Y-axis sensor circuit component, or alternatively a combined X/Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate, or alternatively to a printed circuit board (PCB). The pads may be arranged in variety of designs, including a leadless chip carrier (LCC) design and a ball grid array (BGA) design. An application-specific integrated circuit (ASIC), or sensor support chip, is additionally mounted to the top surface of the rigid substrate. The sensor components and ASIC may be ball bonded or wire bonded to the substrate.

Claims

1. A device comprising:

a rigid substrate having a top surface;

an application-specific integrated circuit (ASIC) attached to the top surface, including input/output (I/O) pads;

an X-axis sensor located on the top surface of the rigid substrate for sensing a physical parameter along an X-axis, the X-axis sensor including I/O pads and in electrical communication with the ASIC;

a Y-axis sensor located on the top surface of the rigid substrate for sensing the physical parameter along a Y-axis, the Y-axis sensor including I/O pads and in electrical communication with the ASIC;

a Z-axis sensor located on the top surface of the rigid substrate for sensing the physical parameter along a Z-axis, the Z-axis sensor including I/O pads and in electrical communication with the ASIC; and

corresponding I/O pads located on the top surface of the rigid substrate for conductively connecting to respective I/O pads on each sensor and ASIC.

2. The device of claim 1, further including an encapsulation layer around the package.

3. The device of claim 1 wherein the I/O pads of the Z-axis sensor are arranged in an array along an edge of the sensor and conductively connect with the corresponding I/O pads of the rigid substrate.

4. The device of claim 3, wherein the I/O pads of the Z-axis sensor are conductively connected to the rigid substrate by solder bumps.

5. The device of claim 4, wherein the I/O pads of the rigid substrate comprise solder-filled vias.

6. The device of claim 1, wherein the I/O pads of the substrate are arranged on an outer perimeter in a leadless chip carrier (LCC) design.

7. The device of claim 1, wherein the I/O pads of the rigid substrate are arranged in a grid in the center of the top surface of the substrate in a ball grid array design.

8. The device of claim 1, wherein the rigid substrate is a printed circuit board (PCB).

9. The device of claim 1, wherein the X-axis sensor and the Y-axis sensor are integrated into a single X-Y-axis sensor.

10. The device of claim 1, wherein the ASIC includes one of more than one circuit and more than one discrete component.

11. The device of claim 1, wherein the ASIC conditions a signal from at least one of the X-axis sensor, the Y-axis sensor, and the Z-axis sensor.

12. The device of claim 1, wherein the physical parameter is a magnetic field.

13. The device of claim 1, wherein the physical parameter is one of an acceleration, a pressure, and an orientation.