Curable Composition for Optical Material and Optical Waveguide
First Claim
Patent Images
1. A curable composition for an optical material, characterized by comprising as essential components:
- (A);
a silicon-containing polymer having an epoxy group, containing a silicon atom having at least three oxygen atoms bonded thereto, having an Si—
R group where R represents an alkyl group, a phenyl group, an alkylphenyl group, or a phenylalkyl group, or an alkyl group, phenyl group, alkylphenyl group, or phenylalkyl group in which some or all hydrogen atoms are substituted with a halogen or deuterium atom and an Si—
OR′
group where R′
represents an alkyl group, a phenyl group, an alkylphenyl group, or a phenylalkyl group, or an alkyl group, phenyl group, alkylphenyl group, or phenylalkyl group in which some or all hydrogen atoms are substituted with a halogen or deuterium atom, and having a weight average molecular weight of 1,000 to 1,000,000;
(B);
an epoxy resin represented by the following general formula (1);
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Abstract
A curable composition for an optical material including a specific silicon-containing polymer (A), a specific epoxy resin (B) and an energy ray-sensitive cationic polymerization initiator (C) as essential components.
11 Citations
23 Claims
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1. A curable composition for an optical material, characterized by comprising as essential components:
-
(A);
a silicon-containing polymer having an epoxy group, containing a silicon atom having at least three oxygen atoms bonded thereto, having an Si—
R group where R represents an alkyl group, a phenyl group, an alkylphenyl group, or a phenylalkyl group, or an alkyl group, phenyl group, alkylphenyl group, or phenylalkyl group in which some or all hydrogen atoms are substituted with a halogen or deuterium atom and an Si—
OR′
group where R′
represents an alkyl group, a phenyl group, an alkylphenyl group, or a phenylalkyl group, or an alkyl group, phenyl group, alkylphenyl group, or phenylalkyl group in which some or all hydrogen atoms are substituted with a halogen or deuterium atom, and having a weight average molecular weight of 1,000 to 1,000,000;(B);
an epoxy resin represented by the following general formula (1); - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification
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Current AssigneeAdeka Corporation
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Original AssigneeAdeka Corporation
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InventorsHara, Kenji, Fujiue, Naofumi, Ishikawa, Yoshihiro, Shoji, Yoshikazu
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current385/142
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CPC Class CodesC08G 59/22 Di-epoxy compoundsC08G 59/226 Mixtures of di-epoxy compoundsC08G 59/306 containing siliconC08G 77/14 containing silicon bound to...C08G 77/70 Siloxanes defined by use of...C08L 2666/14 Macromolecular compounds ac...C08L 63/00 Compositions of epoxy resin...C09D 183/06 containing silicon bound to...G02B 6/1221 made from organic materialsG02B 6/138 by using polymerisation
