LASER DECAL TRANSFER OF ELECTRONIC MATERIALS

• US 20090074987A1
• Filed: 01/07/2008
• Published: 03/19/2009
• Est. Priority Date: 09/14/2007
• Status: Active Grant

• Current Assignee: Photon Dynamics Incorporated (KLA Corporation), the united states of america as represented by the secretary of the navy
• Original Assignee: Photon Dynamics Incorporated (KLA Corporation), The United States of America As Represented By The Secretary of Agriculture
• Inventors: Young, Lydia J., Bailey, Thomas H., Auyeung, Raymond, Pique, Alberto
• Granted Patent: US 8,728,589 B2
• Time in Patent Office: Days
• US Class Current: 427/596
• CPC Class Codes: C23C 14/28 by wave energy or particle radiation C23C14/32 - C23C14/48 take precedence
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence

Abstract

A laser decal transfer is used to generate thin film features by directing laser pulses of very low energy at the back of a target substrate illuminating an area of a thin layer of a high viscosity rheological fluid coating the front surface of the target. The illuminated area is shaped and defined by an aperture centered about the laser beam. The decal transfer process allows for the release and transfer from the target substrate to the receiving substrate a uniform and continuous layer identical in shape and size of the laser irradiated area. The released layer is transferred across the gap with almost no changes to its initial size and shape. The resulting patterns transferred onto the receiving substrate are highly uniform in thickness and morphology, have sharp edge features and exhibit high adhesion, independent of the surface energy, wetting or phobicity of the receiving substrate.

Claims

1. A method for laser deposition comprising:

providing a receiving substrate;

providing a target substrate spaced away from the receiving substrate and comprising a laser transparent support having a back surface and a front surface, wherein the front surface of the target substrate is coated with a layer of a rheological compound of selected thickness and viscosity; and

providing a laser beam directed through the back of the target substrate to illuminate a given area of the coating layer, said incident laser beam having an energy density selected such as to uniformly release and non-evaporately transfer a region of the coating from the target substrate towards the receiving substrate, wherein the transferred rheological compound forms a deposit at a defined location on the surface of the receiving substrate substantially 1-to-1 in size and shape of the incident laser illuminated area, such as to cause decal transfer.

2. The method of claim 1 wherein a viscosity of the rheological compound is equal to or greater than 10,000 centiPoises (cP).

3. The method of claim 1 wherein said coating has a thickness equal to or less than 2 micrometers.

4. The method of claim 1 wherein said method is carried out at about room temperature and at about atmospheric pressure.

5. The method of claim 1 wherein the laser is selected from a group consisting of a pulsed laser and a continuous wave laser.

6. The method of claim 1 wherein the laser beam is focused through a microscope objective lens or other focusing optics to form the incident laser beam.

7. The method of claim 1 wherein the incident laser beam is shaped by an aperture.

8. The method of claim 7 further comprising:

maintaining at least one fixed shaped aperture centered about the laser beam as the target substrate is moved relative to the laser beam.

9. The method of claim 7 further comprising:

maintaining a variable shaped aperture centered about the laser beam as the target substrate is moved relative to the laser beam.

10. The method of claim 9 further comprising:

varying a size of the variable shaped aperture about a center of the laser beam as the target substrate is moved relative to the laser beam.

11. The method of claim 1 wherein the step of providing the laser beam is repeated at successive defined target locations and successive defined receiving locations, and wherein the deposit forms one of a two-dimensional pattern or a three-dimensional pattern.

12. The method of claim 1 wherein the laser-transparent support is selected from a group consisting of glass and polymer plastic.

13. The method of claim 1 wherein the receiving substrate comprises a non-planar surface.

14. The method of claim 1 wherein the rheological compound is selected from a group consisting of paste, gel, ink, concentrated solutions, suspensions, Newtonian fluids, non-Newtonian fluids, viscoelastic fluids, and elasticoviscous fluids.

15. The method of claim 1 further comprising:

maintaining a distance between the target substrate and the receiving substrate within a predefined range as the target substrate is moved relative to the receiving substrate.

16. The method of claim 1 wherein said laser beam has a plurality of wavelengths concurrently present therein.

17. The method of claim 1 further comprising:

varying a pulse length of the laser beam.

18. The method of claim 1 further comprising:

curing the rheological compound deposited on the receiving substrate using the laser beam.

19. The method of claim 1 further comprising:

heating the rheological compound deposited on the receiving substrate.

20. The method of claim 19 further comprising:

curing the rheological compound deposited on the substrate using a second laser beam.

21. The method of claim 1 wherein said receiving substrate comprises micro-circuitry and is selected from a group consisting of flat panel display, solar panel, and semiconductor wafer substrates.

22. The method of claim 1 wherein said deposited rheological compound provides an electrical connection between a pair of nodes.

23. The method of claim 12 wherein said target substrate comprises a first recessed well coated with the rheological compound, said first recessed well adapted to be positioned in the optical path of the laser beam.