MAGNETIC COMPONENTS

• US 20090077791A1
• Filed: 12/08/2008
• Published: 03/26/2009
• Est. Priority Date: 09/22/2005
• Status: Active Grant

• Current Assignee: Radial Electronics, Inc.
• Original Assignee: Radial Electronics, Inc.
• Inventors: Quilici, James E.
• Granted Patent: US 9,355,769 B2
• Time in Patent Office: Days
• US Class Current: 29/602.100
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 2027/2814 with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: H01F 41/0206 Manufacturing of magnetic cores by mechanical means magnetic cores per se H01F27/24
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 41/042 by thin film techniques
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0141 Liquid crystal polymer [LCP]
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0139 Blade or squeegee, e.g. for screen printing or filling of holes
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 2203/0292 : Using vibration, e.g. during soldering or screen printing
• CPC Class Codes: H05K 3/0014 : Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/4611 : by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49075 : including permanent magnet or core

Abstract

Disclosed is an apparatus and method for a magnetic component. The magnetic component includes a substrate having a feature and a first conductive pattern disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, where the substrate material has a second conductive pattern. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeability material.

Claims

1. A method comprising:

forming a feature on a substrate;

disposing a first conductive pattern on the substrate and the feature;

disposing a permeability material within the feature;

disposing a substrate material on the substrate and the feature; and

disposing a second conductive pattern on the substrate material, wherein the first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.

2. The method of claim 1, wherein forming the feature comprises machining a feature on the substrate.

3. The method of claim 1, wherein forming the feature comprises molding a feature on the substrate.

4. The method of claim 1, wherein forming the feature comprises forming a feature utilizing a lithography type process.

5. The method of claim 1, wherein disposing the first conductive pattern comprises stamping a first conductive pattern.

6. The method of claim 1, wherein disposing the first conductive pattern comprises plating a first conductive pattern.

7. The method of claim 1, wherein disposing the first conductive pattern comprises utilizing a lithography type approach.

8. The method of claim 1, wherein disposing the first conductive pattern comprises a laser structuring type approach.

9. The method of claim 1, wherein disposing a permeability material comprises utilizing a pick and place machine.

10. The method of claim 1, wherein disposing a permeability material comprises utilizing a vibration type machine.

11. The method of claim 1, wherein disposing the substrate material comprises laminating a substrate material.

12. The method of claim 1, wherein disposing the substrate material comprises at least one of spraying, rolling, and/or squeegeeing a liquid type dielectric type material.

13. The method of claim 1, wherein disposing the second conductive pattern comprises stamping a second conductive pattern.

14. The method of claim 1, wherein disposing the second conductive pattern comprises plating a second conductive pattern.

15. The method of claim 1 further comprising forming vias operable to electrically couple the first conductive pattern and the second conductive pattern.

16. A method comprising:

forming a feature on a substrate;

disposing a first conductive pattern on the substrate and the feature;

disposing a permeability material within the feature;

disposing a substrate material on the substrate and the feature at least substantially enclosing the permeability material within the feature between the substrate and the substrate material; and

disposing a second conductive pattern on the substrate material, wherein the first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.

17. The method of claim 16, wherein forming a feature on a substrate comprises forming a feature depends from a first surface, wherein the feature defines a groove of revolution about an axis perpendicular to the first surface, the groove defining a groove surface surrounding a groove hub including a portion of the first surface.

18. The method of claim 28, wherein forming a feature on a substrate comprises forming a feature on a substrate defining a toroidal type shape.

19. The method of claim 16, wherein disposing a permeability material within the feature comprises disposing a ferromagnetic type material within the feature, and wherein the first conductive pattern and the second conductive pattern cooperate to be operable for inducing a magnetic field upon the ferromagnetic type material.

20. The method of claim 16, wherein disposing a first conductive pattern on the substrate and the feature comprises disposing a plurality of discontinuous conductive traces radiating from about the axis, the conductive pattern extending from the groove hub, the groove surface, to external the groove about a periphery of the groove, and

wherein disposing a second conductive pattern on the substrate material comprises disposing a plurality of discontinuous conductive traces radiating from about an axis and when coupled to the first surface, the conductive traces extend from the groove hub to the groove periphery affecting an electrical coupling therewith.

21. The method of claim 16, wherein disposing a second conductive pattern on the substrate material further comprises electrically interconnecting the first and second conductive patterns so as to define at least one continuous winding beginning at a first interconnect and terminating at a second interconnect.

22. The method of claim 16, further comprising providing vias between the first conductive pattern and the second conductive pattern electrically coupling the first conductive pattern and the second conductive pattern in electrical communication.

23. The method of claim 16, further comprising providing interconnects between the first conductive pattern and the second conductive pattern electrically coupling the first conductive pattern and the second conductive pattern in electrical communication.

24. The method of claim 23, wherein electrically coupling the first and second conductive patterns comprises electrically coupling the first conductive pattern and second conductive pattern operable to define four interleaved electrical paths capable of facilitating a dual common mode filter type functionality.

25. The method of claim 23, wherein electrically coupling the first and second conductive patterns comprises electrically coupling the first conductive pattern and second conductive pattern operable to define two interleaved electrical paths capable of facilitating a single common mode filter type functionality.

26. The method of claim 23, wherein electrically coupling the first and second conductive patterns comprises electrically coupling the first conductive pattern and second conductive pattern operable to define two interleaved electrical paths capable of facilitating a single inductor type functionality.

27. The method of claim 23, wherein electrically coupling the first and second conductive patterns comprises electrically coupling the first conductive pattern and second conductive pattern operable to define two interleaved electrical paths capable of facilitating a transformer type functionality.

28. The method of claim 16, further comprising forming a second feature on the substrate material wherein the substrate material defines a second surface, the second feature depending from the second surface, wherein the second feature defines a second groove of revolution about an axis perpendicular to the second surface, the second groove defining a second groove surface surrounding a second groove hub including a portion of the second surface, and

wherein disposing a second conductive pattern on the substrate material comprises disposing a second conductive pattern on second surface and the second feature, and

wherein disposing a substrate material on the substrate and the feature at least substantially enclosing the permeability material within the feature between the substrate and the substrate material comprises engaging the second surface on the substrate with the substrate and substrate material in cooperative engagement so as to define a cavity defined by the first groove and the second groove.

29. The method of claim 17, further comprising forming a second feature on the substrate material wherein the substrate material defines a second surface, the second feature depending from the second surface, wherein the second feature defines a second groove of revolution about an axis perpendicular to the second surface, the second groove defining a second groove surface surrounding a second groove hub including a portion of the second surface, and

wherein disposing a second conductive pattern on the substrate material comprises disposing a second conductive pattern on second surface and the second feature, and

wherein disposing a substrate material on the substrate and the feature at least substantially enclosing the permeability material within the feature between the substrate and the substrate material comprises engaging the second surface on the substrate with the substrate and substrate material in cooperative engagement so as to define a cavity defined by the first groove and the second groove.